Invention Application
- Patent Title: PATTERN MEASURING APPARATUS
- Patent Title (中): 图案测量装置
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Application No.: US13789323Application Date: 2013-03-07
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Publication No.: US20140021349A1Publication Date: 2014-01-23
- Inventor: Hiroshi Nishihama , Tatsuya MAEDA , Mitsuji IKEDA , Susumu KOYAMA
- Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2012-161107 20120720
- Main IPC: H01J37/26
- IPC: H01J37/26

Abstract:
An object of the present invention is to provide a pattern measuring apparatus which performs high-accuracy concavity/convexity determination (e.g., distinguishing between a line segment and space) while simultaneously reducing the dose of a beam falling onto a pattern to be measured. To attain the object, this invention proposes a pattern measuring apparatus which specifies a pattern in a measurement object area by scanning a tilted bean with respect to another area different from the measurement object area and then performs measurement based on the pattern-specifying result. With such arrangement, it becomes possible to perform measurement without the risk of wrong pattern designation while lowering the dose of a beam hitting the measurement object area.
Public/Granted literature
- US08618517B1 Pattern measuring apparatus Public/Granted day:2013-12-31
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