Invention Application
- Patent Title: DISPLAY SYSTEM WITH THIN FILM ENCAPSULATED INVERTED IMOD
- Patent Title (中): 具有薄膜封装反射IMOD的显示系统
-
Application No.: US13560732Application Date: 2012-07-27
-
Publication No.: US20140028686A1Publication Date: 2014-01-30
- Inventor: Rihui He , Marek Mienko , Alok Govil , Tsongming Kao
- Applicant: Rihui He , Marek Mienko , Alok Govil , Tsongming Kao
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS TECHNOLOGIES, INC.
- Current Assignee: QUALCOMM MEMS TECHNOLOGIES, INC.
- Current Assignee Address: US CA San Diego
- Main IPC: G06T1/00
- IPC: G06T1/00 ; H01L33/60 ; G02B26/00

Abstract:
This disclosure provides systems, methods and apparatus for encapsulating a display device. In one aspect, an interferometric modulator (IMOD) is formed on a substrate. The IMOD includes an absorbing layer separated from the substrate, a reflective layer between the absorbing layer and the substrate, and an optical gap between the absorbing layer and the reflective layer. One or more thin film encapsulation layers hermetically seal the IMOD between the one or more thin film encapsulation layers and the substrate. In another aspect, an optical or functional layer can be formed over the one or more thin film encapsulation layers.
Information query