ENCAPSULATED ARRAYS OF ELECTROMECHANICAL SYSTEMS DEVICES
    1.
    发明申请
    ENCAPSULATED ARRAYS OF ELECTROMECHANICAL SYSTEMS DEVICES 审中-公开
    电磁系统装置的封装阵列

    公开(公告)号:US20130135184A1

    公开(公告)日:2013-05-30

    申请号:US13306753

    申请日:2011-11-29

    CPC classification number: B81C1/00317 B81C2203/0145

    Abstract: This disclosure provides systems, methods and apparatus for encapsulating electromechanical systems devices. In one aspect, large arrays of electromechanical systems devices can be encapsulated. In one aspect the encapsulation includes an encapsulation layer supported over the electromechanical systems devices by encapsulation layer supports. The encapsulation layer can also include a plurality of orifices. The orifices can be sealed such that the electromechanical systems devices below are not damaged.

    Abstract translation: 本公开提供了用于封装机电系统装置的系统,方法和装置。 在一个方面,可以封装大型机电系统装置阵列。 在一个方面,封装包括通过封装层支撑在机电系统装置上支撑的封装层。 封装层还可以包括多个孔。 孔可以被密封,使得下面的机电系统装置不被损坏。

    METHODS OF CREATING SPACERS BY SELF-ASSEMBLY
    2.
    发明申请
    METHODS OF CREATING SPACERS BY SELF-ASSEMBLY 审中-公开
    通过自组织创建间隔的方法

    公开(公告)号:US20130083038A1

    公开(公告)日:2013-04-04

    申请号:US13252109

    申请日:2011-10-03

    Applicant: Rihui HE

    Inventor: Rihui HE

    CPC classification number: B81B7/0058

    Abstract: This disclosure provides systems, methods and apparatus for fabricating spacers for electromechanical systems devices. In one aspect, a method of forming a spacer on a spacer portion of a device surface of an electromechanical systems device includes exposing the device surface to spacer particles suspended in a fluid. The spacer particles are allowed to attach to the spacer portion. Each of the spacer particles can have at least one dimension of about 1 micron to 10 microns. The electromechanical systems device can also include a sacrificial layer that is subsequently removed between the device surface and a substrate surface of a substrate on which the electromechanical systems device is formed.

    Abstract translation: 本公开提供了用于制造用于机电系统装置的间隔件的系统,方法和装置。 一方面,在机电系统装置的装置表面的间隔部分上形成间隔物的方法包括将装置表面暴露于悬浮在流体中的间隔物颗粒。 允许间隔物颗粒附着到间隔物部分。 每个间隔物颗粒可以具有约1微米至10微米的至少一个尺寸。 机电系统装置还可以包括牺牲层,其随后在器件表面和其上形成有机电系统器件的衬底的衬底表面之间移除。

    Electromechanical systems device
    3.
    发明授权
    Electromechanical systems device 有权
    机电系统装置

    公开(公告)号:US08803861B2

    公开(公告)日:2014-08-12

    申请号:US13403792

    申请日:2012-02-23

    CPC classification number: G02B26/001 G02B26/0841

    Abstract: This disclosure provides systems, methods and apparatus for EMS devices. In one aspect, an EMS device includes an array of display elements and a plurality of driver lines with at least a portion of the plurality of driver lines routed above or below the array between one or more driver circuits and the array. In some implementations, at least a portion of the plurality of driver lines is disposed above a non-active area of the array. In one aspect, an EMS device can form a portion of at least one of the plurality of driver lines. In some implementations, movable layers of the array can be disposed between at least a portion of the plurality of driver lines and stationary electrodes of the display.

    Abstract translation: 本公开提供了EMS设备的系统,方法和设备。 在一个方面,EMS设备包括显示元件阵列和多个驱动器线,其中多个驱动器线的至少一部分在一个或多个驱动器电路和阵列之间路由到阵列的上方或下方。 在一些实现中,多个驱动器线的至少一部分设置在阵列的非有效区域之上。 在一个方面,EMS装置可以形成多个驱动器线中的至少一个的一部分。 在一些实施方案中,阵列的可移动层可以设置在多个驱动线的至少一部分和显示器的固定电极之间。

    ELECTROMECHANICAL SYSTEMS DEVICE
    4.
    发明申请
    ELECTROMECHANICAL SYSTEMS DEVICE 有权
    电子系统设备

    公开(公告)号:US20130222351A1

    公开(公告)日:2013-08-29

    申请号:US13403792

    申请日:2012-02-23

    CPC classification number: G02B26/001 G02B26/0841

    Abstract: This disclosure provides systems, methods and apparatus for EMS devices. In one aspect, an EMS device includes an array of display elements and a plurality of driver lines with at least a portion of the plurality of driver lines routed above or below the array between one or more driver circuits and the array. In some implementations, at least a portion of the plurality of driver lines is disposed above a non-active area of the array. In one aspect, an EMS device can form a portion of at least one of the plurality of driver lines. In some implementations, movable layers of the array can be disposed between at least a portion of the plurality of driver lines and stationary electrodes of the display.

    Abstract translation: 本公开提供了EMS设备的系统,方法和设备。 在一个方面,EMS设备包括显示元件阵列和多个驱动器线,其中多个驱动器线的至少一部分在一个或多个驱动器电路和阵列之间路由到阵列的上方或下方。 在一些实现中,多个驱动器线的至少一部分设置在阵列的非有效区域之上。 在一个方面,EMS装置可以形成多个驱动器线中的至少一个的一部分。 在一些实施方案中,阵列的可移动层可以设置在多个驱动线的至少一部分和显示器的固定电极之间。

    Optimization of desiccant usage in a MEMS package
    5.
    发明授权
    Optimization of desiccant usage in a MEMS package 失效
    MEMS封装中干燥剂使用的优化

    公开(公告)号:US08435838B2

    公开(公告)日:2013-05-07

    申请号:US12680503

    申请日:2007-09-28

    CPC classification number: B81C1/00285 B81C1/00674

    Abstract: A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.

    Abstract translation: MEMS器件可以用干燥剂包装以提供无湿度的环境。 为了避免对MEMS器件的不期望的影响,可以选择或处理干燥剂以便与特定的MEMS器件兼容。 这种处理可以包括烘烤干燥剂,以引起除湿或其它不期望的物质。 还可以改变MEMS器件的结构,以改善与特定干燥剂的相容性。

    DISPLAY SYSTEM WITH THIN FILM ENCAPSULATED INVERTED IMOD
    7.
    发明申请
    DISPLAY SYSTEM WITH THIN FILM ENCAPSULATED INVERTED IMOD 审中-公开
    具有薄膜封装反射IMOD的显示系统

    公开(公告)号:US20140028686A1

    公开(公告)日:2014-01-30

    申请号:US13560732

    申请日:2012-07-27

    CPC classification number: G02B26/001 G02B26/0841

    Abstract: This disclosure provides systems, methods and apparatus for encapsulating a display device. In one aspect, an interferometric modulator (IMOD) is formed on a substrate. The IMOD includes an absorbing layer separated from the substrate, a reflective layer between the absorbing layer and the substrate, and an optical gap between the absorbing layer and the reflective layer. One or more thin film encapsulation layers hermetically seal the IMOD between the one or more thin film encapsulation layers and the substrate. In another aspect, an optical or functional layer can be formed over the one or more thin film encapsulation layers.

    Abstract translation: 本公开提供了用于封装显示装置的系统,方法和装置。 一方面,在衬底上形成干涉式调制器(IMOD)。 IMOD包括从衬底分离的吸收层,在吸收层和衬底之间的反射层以及吸收层和反射层之间的光学间隙。 一个或多个薄膜封装层在一个或多个薄膜封装层和衬底之间密封IMOD。 在另一方面,可以在一个或多个薄膜封装层上形成光学或功能层。

    STORAGE CAPACITOR FOR ELECTROMECHANICAL SYSTEMS AND METHODS OF FORMING THE SAME
    8.
    发明申请
    STORAGE CAPACITOR FOR ELECTROMECHANICAL SYSTEMS AND METHODS OF FORMING THE SAME 审中-公开
    用于机电系统的存储电容器及其形成方法

    公开(公告)号:US20130120327A1

    公开(公告)日:2013-05-16

    申请号:US13533778

    申请日:2012-06-26

    CPC classification number: G02B26/001

    Abstract: This disclosure provides systems, methods and apparatus for storage capacitors. In one aspect, a device includes an array having at least a first display element and a second display element, at least one switch configured to control a flow of charge between a source and the first display element, and at least one interferometric optical mask structure disposed in a non-active area of the array between the first display element and the second display element. The optical mask structure includes a storage capacitor formed by a first conductive layer and a second conductive layer. The storage capacitor is electrically coupled to the at least one switch and the first display element.

    Abstract translation: 本公开提供了用于存储电容器的系统,方法和装置。 一方面,一种装置包括具有至少第一显示元件和第二显示元件的阵列,至少一个开关,被配置为控制源极与第一显示元件之间的电荷流动,以及至少一个干涉光学掩模结构 设置在第一显示元件和第二显示元件之间的阵列的非有源区域中。 光掩模结构包括由第一导电层和第二导电层形成的存储电容器。 存储电容器电耦合到至少一个开关和第一显示元件。

    METHOD FOR FORMING FREE STANDING MICROSTRUCTURES
    10.
    发明申请
    METHOD FOR FORMING FREE STANDING MICROSTRUCTURES 审中-公开
    形成自由定位微结构的方法

    公开(公告)号:US20060273065A1

    公开(公告)日:2006-12-07

    申请号:US11421715

    申请日:2006-06-01

    CPC classification number: B81C1/00333 B81C2203/0136 B81C2203/0145

    Abstract: A method of forming free standing microstructures includes providing a substrate and forming a sacrificial layer on the substrate. A thin-film structural layer is then formed around and over the sacrificial layer. The sacrificial layer may be formed from an electrically conductive or non-electrically conductive material in certain embodiments of the invention. Nanometer-scale pores are then introduced through the thin-film structural layer by a non-lithographic method, such as anodic etching. Via the pores, at least a portion of the sacrificial layer is etched away or otherwise removed from underneath the thin-film structural layer. The free standing microstructures may be sealed by application of a sealing layer on top thereof. The microstructure may form an encapsulating cavity and provide integrated on-wafer packaging if separate microdevices are disposed inside the cavity. The entire process may be done at or near room temperature in some cases.

    Abstract translation: 形成自由立体微结构的方法包括提供衬底并在衬底上形成牺牲层。 然后在牺牲层周围形成薄膜结构层。 在本发明的某些实施例中,牺牲层可以由导电或非导电材料形成。 然后通过非平版印刷法,例如阳极蚀刻,通过薄膜结构层引入纳米级的孔。 通过孔,牺牲层的至少一部分被蚀刻掉或以其它方式从薄膜结构层下方移除。 可以通过在其顶部施加密封层来密封自立式微结构。 如果单独的微型器件设置在空腔内,则微结构可以形成封装空腔并提供集成的晶片封装。 在某些情况下,整个过程可以在室温或室温附近完成。

Patent Agency Ranking