发明申请
US20140043067A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD AND OPERATING METHOD OF THE SAME 有权
半导体结构及其制造方法及其工作方法

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD AND OPERATING METHOD OF THE SAME
摘要:
A semiconductor structure and a manufacturing method and an operating method of the same are provided. The semiconductor structure includes a substrate, a main body structure, a first dielectric layer, a first conductive strip, a second conductive strip, a second dielectric layer, and a conductive structure. The main body structure is formed on the substrate, and the first dielectric layer is formed on the substrate and surrounding two sidewalls and a top portion of the main body structure. The first conductive strip and the second conductive strip are formed on two sidewalls of the first dielectric layer, respectively. The second dielectric layer is formed on the first dielectric layer, the first conductive strip, and the second conductive strip. The conductive structure is formed on the second dielectric layer.
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