发明申请
US20140053966A1 METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WAFER LEVEL PACKAGED INFRARED FOCAL PLANE ARRAYS
有权
用于水平包装的红外焦平面阵列的抗反射涂层盖子中的应力消除方法
- 专利标题： METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WAFER LEVEL PACKAGED INFRARED FOCAL PLANE ARRAYS
- 专利标题（中）： 用于水平包装的红外焦平面阵列的抗反射涂层盖子中的应力消除方法
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申请号： US13688714申请日： 2012-11-29
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公开(公告)号： US20140053966A1公开(公告)日： 2014-02-27
- 发明人: Roland W. Gooch , Buu Q. Diep , Stephen H. Black , Thomas A. Kocian , Adam M. Kennedy
- 申请人： RAYTHEON COMPANY
- 申请人地址： US MA Waltham
- 专利权人： Raytheon Company
- 当前专利权人： Raytheon Company
- 当前专利权人地址： US MA Waltham
- 主分类号： B05D5/06
- IPC分类号： B05D5/06
摘要：
Methods for reducing wafer bow induced by an anti-reflective coating of a cap wafer are provided. The method may utilize a shadow mask having at least one opening therein that is positioned opposite recessed regions in a cap wafer. The method may further include depositing at least one layer of an anti-reflective coating material through the shadow mask onto a planar side of a cap wafer to provide a discontinuous coating on the planar side.
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