Invention Application
US20140054793A1 Chip on Film (COF) Substrate, COF Package and Display Device Including the Same
有权
芯片贴片(COF)衬底,包括它的COF封装和显示设备
- Patent Title: Chip on Film (COF) Substrate, COF Package and Display Device Including the Same
- Patent Title (中): 芯片贴片(COF)衬底,包括它的COF封装和显示设备
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Application No.: US13933185Application Date: 2013-07-02
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Publication No.: US20140054793A1Publication Date: 2014-02-27
- Inventor: Jeong-Kyu Ha , Kwan-Jai Lee , Jae-Min Jung , Kyong-Soon Cho , Na-Rae Shin , Kyoung-Suk Yang , Pa-Lan Lee , So-Young Lim
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2012-0092056 20120823
- Main IPC: H01L23/498
- IPC: H01L23/498

Abstract:
A COF substrate may include a base film, first upper conductive patterns, at least one second upper conductive pattern and lower conductive patterns. The first upper conductive patterns may be arranged on an upper surface of the base film. Each of the first upper conductive patterns may have an inner pattern and an outer pattern spaced apart from each other. The second upper conductive pattern may be arranged on the upper surface of the base film between the first upper conductive patterns. The lower conductive patterns may be arranged on a lower surface of the base film. The lower conductive patterns may be electrically connected between the inner pattern and the outer pattern. Thus, conductive materials causing a short between the panel patterns may not exist between the inner pattern and the outer pattern on the upper surface of the base film.
Public/Granted literature
- US09059162B2 Chip on film (COF) substrate, COF package and display device including the same Public/Granted day:2015-06-16
Information query
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