发明申请
US20140060904A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
审中-公开
印刷线路板和制造印刷线路板的方法
- 专利标题： PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- 专利标题（中）： 印刷线路板和制造印刷线路板的方法
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申请号： US14015167申请日： 2013-08-30
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公开(公告)号： US20140060904A1公开(公告)日： 2014-03-06
- 发明人: Kazuki KAJIHARA
- 申请人： IBIDEN CO., LTD.
- 申请人地址： JP Ogaki-shi
- 专利权人： IBIDEN CO., LTD.
- 当前专利权人： IBIDEN CO., LTD.
- 当前专利权人地址： JP Ogaki-shi
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K3/10
摘要：
A printed wiring board has an interlayer insulation layer, a conductive pattern formed on the interlayer insulation layer, a solder-resist layer formed on the interlayer insulation layer and the conductive pattern and having an opening portion exposing a portion of the conductive pattern and a portion of the interlayer insulation layer around the portion of the conductive pattern, a metal layer formed in the opening portion of the solder-resist layer such that the metal layer is covering the portion of the conductive pattern and the portion of the interlayer insulation layer exposed through the opening portion of the solder-resist layer, and a bump structure formed in the opening portion of the solder-resist layer such that the bump structure is formed on the metal layer in the opening portion of the solder-resist layer.
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