公开(公告)号：US20170033036A1

公开(公告)日：2017-02-02

申请号：US15223247

申请日：2016-07-29

申请人： IBIDEN CO., LTD.

发明人： Kazuki KAJIHARA ,  Takema ADACHI ,  Teruyuki ISHIHARA

IPC分类号： H01L23/498 ,  H05K3/34 ,  H01L25/065 ,  H05K3/24

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/5389 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1533 ,  H01L2924/181 ,  H05K3/243 ,  H05K3/244 ,  H05K3/424 ,  H05K3/4658 ,  H05K3/4682 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0156 ,  H05K2203/0723 ,  H01L2924/00012

摘要： A printed wiring board includes a buildup wiring layer including resin insulation layers and conductive layers such that the conductive layers are laminated on the resin insulation layers, respectively, first pads formed in a center portion of a first surface of the buildup wiring layer and positioned to connect an electronic component, second pads formed on a periphery portion of the first surface of the buildup wiring layer and positioned to connect an external wiring board, a solder layer including a plating material and formed on the first pads such that the solder layer is formed on each of the first pads, conductive posts including a plating material and formed on the second pads, respectively, and a seed layer including first seed layer portions formed between the first pads and the solder layer and second seed layer portions formed between the second pads and the conductive posts.

摘要翻译： 印刷电路板包括：积层布线层，包括树脂绝缘层和导电层，使得导电层分别层压在树脂绝缘层上的第一焊盘，其形成在堆积布线层的第一表面的中心部分并且定位成 连接形成在积层布线层的第一表面的周边部分上并定位成连接外部布线板的电子部件，第二焊盘，包括电镀材料的焊料层，并形成在第一焊盘上，使得形成焊料层 在每个第一焊盘上，分别包括电镀材料并形成在第二焊盘上的导电柱，以及种子层，其包括形成在第一焊盘和焊料层之间的第一种子层部分和形成在第二焊盘之间的第二种子层部分 和导电柱。

公开(公告)号：US20140060905A1

公开(公告)日：2014-03-06

申请号：US14015316

申请日：2013-08-30

申请人： IBIDEN CO., LTD.

发明人： Kazuki KAJIHARA

IPC分类号： H05K1/02 ,  H05K3/10

CPC分类号： H05K1/0298 ,  H01L2224/13 ,  H05K3/10 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4644

摘要： A printed wiring board has an interlayer insulation layer, a conductive pattern formed on the interlayer insulation layer, a solder-resist layer formed on the interlayer insulation layer and conductive pattern and having opening exposing a portion of the conductive pattern and a portion of the interlayer insulation layer around the portion of the conductive pattern, a metal layer formed in the opening of the solder-resist layer such that the metal layer is covering the portion of the conductive pattern exposed through the opening of the solder-resist layer, and a bump formed in the opening of the solder-resist layer such that the bump is on the metal layer in the opening of the solder-resist layer. The opening of the solder-resist layer has space formed with side surface of the bump, inner wall of the solder-resist layer and the portion of the interlayer insulation layer in the opening of the solder-resist layer.

摘要翻译： 印刷布线板具有层间绝缘层，形成在层间绝缘层上的导电图案，形成在层间绝缘层上的阻焊层和导电图案，并且具有露出导电图案的一部分和中间层的一部分的开口 在导电图案的周围的绝缘层，形成在阻焊层的开口中的金属层，使得金属层覆盖通过阻焊层的开口暴露的导电图案的部分，以及凸块 形成在阻焊层的开口中，使得凸起位于阻焊层的开口中的金属层上。 阻焊层的开口部形成有凸块的侧面，阻焊层的内壁，以及阻焊层的开口部的层间绝缘层的部分。

公开(公告)号：US20180116057A1

公开(公告)日：2018-04-26

申请号：US15793084

申请日：2017-10-25

申请人： IBIDEN CO., LTD.

发明人： Kazuki KAJIHARA ,  Naoki KURAHASHI

IPC分类号： H05K3/46 ,  H05K1/18 ,  H05K3/00 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09

CPC分类号： H05K3/4697 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/036 ,  H05K1/09 ,  H05K1/183 ,  H05K1/186 ,  H05K3/0032 ,  H05K3/0097 ,  H05K3/4007 ,  H05K3/4655 ,  H05K3/4682 ,  H05K2201/0209 ,  H05K2203/308

摘要： A printed wiring board includes a laminate, conductor posts formed on a surface of the laminate, and a mold resin layer formed on the surface of the laminate such that the posts are in the mold layer covering side surfaces of the posts. The laminate includes conductor layers and one or more resin insulating layers, the conductor layers includes a first conductor layer embedded in a resin insulating layer forming the surface of the laminate and has one surface exposed on the surface of the laminate, the first conductor layer includes first and second conductor pads such that the second pads are formed on outer peripheral side of the first pads, the mold layer has a cavity exposing the first pads, the posts are formed on the second pads on the surface of the laminate, and the first conductor layer includes fan-out wirings extending from inside to outside the cavity.

公开(公告)号：US20150034378A1

公开(公告)日：2015-02-05

申请号：US14446702

申请日：2014-07-30

申请人： IBIDEN CO., LTD.

发明人： Kazuki KAJIHARA ,  Yasuki Kimishima

IPC分类号： H05K1/11 ,  H05K3/24 ,  H05K3/10

CPC分类号： H05K3/427 ,  H05K1/0366 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0355 ,  H05K2201/09536 ,  H05K2203/1476 ,  H05K2203/1492

摘要： A printed wiring board includes an insulative resin substrate having a penetrating hole, a first conductive layer formed on first surface of the substrate, a second conductive layer formed on second surface of the substrate on the opposite side, and a through-hole conductor formed in the penetrating hole and connecting the first and second conductive layers. The through-hole conductor includes a seed layer on inner wall of the penetrating hole, a first electrolytic plated layer on the seed layer such that the first plated layer is filling the space formed by the seed layer in the penetrating hole and forming recesses at the ends of the penetrating hole, respectively, and second electrolytic plated layers filling the recesses, respectively, and the second plated layers includes electrolytic plating having an average crystalline particle diameter greater than an average crystalline particle diameter of electrolytic plating forming the first plated layer.

摘要翻译： 印刷电路板包括具有贯通孔的绝缘树脂基板，形成在基板的第一表面上的第一导电层，在相对侧的基板的第二表面上形成的第二导电层，以及形成在 穿透孔并连接第一和第二导电层。 所述通孔导体在所述贯通孔的内壁上具有种子层，所述种子层上的第一电解电镀层，使得所述第一镀层在所述贯通孔中填充由所述籽晶层形成的空间， 并且第二镀层分别包括平均结晶粒径大于形成第一镀层的电解电镀的平均结晶粒径的电解电镀。

公开(公告)号：US20170309558A1

公开(公告)日：2017-10-26

申请号：US15492291

申请日：2017-04-20

申请人： IBIDEN CO., LTD.

发明人： Kazuki KAJIHARA

IPC分类号： H01L23/498 ,  H01L23/29 ,  H01L23/31 ,  H01L25/00 ,  H01L25/10 ,  H01L21/48 ,  H01L23/00

CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/09 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/48091 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094

摘要： An interposer includes an insulating layer, conductor circuits formed in grooves formed on a first surface of the insulating layer respectively, and metal posts formed in openings extending from the grooves to a second surface of the insulating layer on the opposite side with respect to the first surface such that the metal posts are connected to the conductor circuits respectively. The insulating layer has an opening portion which accommodates an electronic component and is extending from the first surface to the second surface of the insulating layer, and each of the metal posts has an upper surface and a bottom surface on the opposite side of the upper surface such that the upper surface is connected to a respective one of the conductor circuits and that the bottom surface is exposed from the second surface of the insulating layer.

公开(公告)号：US20170053878A1

公开(公告)日：2017-02-23

申请号：US15239865

申请日：2016-08-18

申请人： IBIDEN CO., LTD.

发明人： Kazuki KAJIHARA ,  Takema ADACHI ,  Teruyuki ISHIHARA ,  Kosuke IKEDA

IPC分类号： H01L23/00 ,  H01L21/48 ,  H01L25/10 ,  H01L23/498 ,  H01L23/31

CPC分类号： H01L23/49822 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/5389 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1058 ,  H01L2924/00014

摘要： A printed wiring board includes a build-up layer including insulating and conductor layers, pads formed on surface of the build-up layer and including first pads to connect an electronic component and second pads to connect an external wiring board onto the surface of the build-up layer, a mold resin layer formed on the surface of the build-up layer such that the mold layer is covering the surface of the build-up layer and has a cavity exposing the first pads and openings exposing the second pads, and conductor posts formed in the openings and including plating material such that the posts are connected to the second pads. The plating material of the posts includes electroless plating layer and electrolytic plating layer, and the posts are formed such that each post has an end surface exposed from surface of the mold layer on the opposite side with respect to the second pads.

摘要翻译： 印刷电路板包括包含绝缘层和导体层的堆积层，形成在堆积层的表面上的焊盘，并且包括用于连接电子部件的第一焊盘和将外部布线板连接到建筑物的表面上的第二焊盘 上层，形成在堆积层的表面上的模制树脂层，使得模制层覆盖积层的表面并且具有暴露第一焊盘和暴露第二焊盘的开口的腔，以及导体 形成在开口中并包括电镀材料的柱，使得柱连接到第二垫。 柱的电镀材料包括无电解镀层和电解镀层，并且柱形成为使得每个柱具有相对于第二焊盘在相对侧的表面暴露于模具层的端面。

公开(公告)号：US20140338965A1

公开(公告)日：2014-11-20

申请号：US14261804

申请日：2014-04-25

申请人： IBIDEN CO., LTD.

发明人： Kazuki KAJIHARA

IPC分类号： H05K1/11 ,  H05K3/00

CPC分类号： H05K3/426 ,  H05K2201/09563 ,  H05K2203/072 ,  H05K2203/0723

摘要： A printed wiring board includes an insulative resin substrate having a penetrating hole, a first conductive layer formed on first surface of the substrate, a second conductive layer formed on second surface of the substrate, and a through-hole conductor formed in the hole such that the conductor is connecting the first and second conductive layers. The conductor has a seed layer on inner wall of the hole, a laminated plated layer on the seed layer and a filled plated layer on the laminated layer, the laminated layer is formed such that the laminated layer is closing center portion of the hole and forming recess at end of the hole, the filled layer is formed such that the filled layer is filling the recess, and the laminated layer includes multiple electrolytic plated films laminated along the seed layer and each having thickness which is less at edge than at center.

摘要翻译： 印刷电路板包括具有贯通孔的绝缘树脂基板，形成在基板的第一表面上的第一导电层，形成在基板的第二表面上的第二导电层和形成在孔中的通孔导体，使得 导体连接第一和第二导电层。 导体在孔的内壁上具有种子层，种子层上的层压镀层和层压层上的填充镀层，形成层压层，使得层压层是闭合孔的中心部分并形成 凹陷在孔的端部，填充层形成为填充层填充凹部，并且层压层包括沿着种子层层叠的多个电解电镀膜，并且每个具有比在中心处边缘的厚度更小的厚度。

公开(公告)号：US20140060904A1

公开(公告)日：2014-03-06

申请号：US14015167

申请日：2013-08-30

申请人： IBIDEN CO., LTD.

发明人： Kazuki KAJIHARA

IPC分类号： H05K1/02 ,  H05K3/10

CPC分类号： H05K1/0298 ,  H01L2224/13 ,  H05K3/10 ,  H05K3/3457 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4644 ,  H05K2203/041

摘要： A printed wiring board has an interlayer insulation layer, a conductive pattern formed on the interlayer insulation layer, a solder-resist layer formed on the interlayer insulation layer and the conductive pattern and having an opening portion exposing a portion of the conductive pattern and a portion of the interlayer insulation layer around the portion of the conductive pattern, a metal layer formed in the opening portion of the solder-resist layer such that the metal layer is covering the portion of the conductive pattern and the portion of the interlayer insulation layer exposed through the opening portion of the solder-resist layer, and a bump structure formed in the opening portion of the solder-resist layer such that the bump structure is formed on the metal layer in the opening portion of the solder-resist layer.

摘要翻译： 印刷布线板具有层间绝缘层，形成在层间绝缘层上的导电图案，形成在层间绝缘层上的阻焊层和导电图案，并且具有露出导电图案的一部分的开口部分和部分 在所述导电图案的所述部分周围的所述层间绝缘层，形成在所述阻焊层的开口部分中的金属层，使得所述金属层覆盖所述导电图案的所述部分，并且所述层间绝缘层的所述部分通过 阻焊层的开口部分和形成在阻焊层的开口部分中的凸起结构，使得在阻焊层的开口部分的金属层上形成凸起结构。