发明申请
US20140060905A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
审中-公开
印刷线路板和制造印刷线路板的方法
- 专利标题： PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- 专利标题（中）： 印刷线路板和制造印刷线路板的方法
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申请号： US14015316申请日： 2013-08-30
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公开(公告)号： US20140060905A1公开(公告)日： 2014-03-06
- 发明人: Kazuki KAJIHARA
- 申请人： IBIDEN CO., LTD.
- 申请人地址： JP OGAKI
- 专利权人： IBIDEN CO., LTD.
- 当前专利权人： IBIDEN CO., LTD.
- 当前专利权人地址： JP OGAKI
- 优先权： JP2012-191303 20120831
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K3/10
摘要：
A printed wiring board has an interlayer insulation layer, a conductive pattern formed on the interlayer insulation layer, a solder-resist layer formed on the interlayer insulation layer and conductive pattern and having opening exposing a portion of the conductive pattern and a portion of the interlayer insulation layer around the portion of the conductive pattern, a metal layer formed in the opening of the solder-resist layer such that the metal layer is covering the portion of the conductive pattern exposed through the opening of the solder-resist layer, and a bump formed in the opening of the solder-resist layer such that the bump is on the metal layer in the opening of the solder-resist layer. The opening of the solder-resist layer has space formed with side surface of the bump, inner wall of the solder-resist layer and the portion of the interlayer insulation layer in the opening of the solder-resist layer.
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