发明申请
- 专利标题： SPUTTERING DEVICE
- 专利标题（中）： 喷射装置
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申请号： US13760758申请日： 2013-02-06
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公开(公告)号： US20140076714A1公开(公告)日： 2014-03-20
- 发明人: Jin Ho HWANG , Do-Hyun KIM , Sang Won SHIN , Woo Song KIM , Chang-Oh JEONG
- 申请人： SAMSUNG DISPLAY CO., LTD.
- 申请人地址： KR Yongin-City
- 专利权人： SAMSUNG DISPLAY CO., LTD.
- 当前专利权人： SAMSUNG DISPLAY CO., LTD.
- 当前专利权人地址： KR Yongin-City
- 优先权： KR10-2012-0103290 20120918
- 主分类号： C23C14/35
- IPC分类号： C23C14/35
摘要：
A sputtering device includes: a sputtering target; a substrate supporter facing the sputtering target and upon which a substrate is disposed; an anode mask between the sputtering target and the substrate which is on the substrate supporter; and a gas distribution member between the anode mask and the sputtering target, and including a plurality of gas distribution tubes separated from each other. Each gas distribution tube includes a plurality of discharge holes defined therein and through which gas is discharged to a vacuum chamber configured to receive the sputtering device.
公开/授权文献
- US09340868B2 Sputtering device 公开/授权日：2016-05-17
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