公开(公告)号：US20140076714A1

公开(公告)日：2014-03-20

申请号：US13760758

申请日：2013-02-06

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Jin Ho HWANG ,  Do-Hyun KIM ,  Sang Won SHIN ,  Woo Song KIM ,  Chang-Oh JEONG

IPC分类号： C23C14/35

CPC分类号： C23C14/352 ,  C23C14/0063 ,  C23C14/35 ,  C23C16/455 ,  C23C16/45565 ,  H01J37/3244 ,  H01J37/32449 ,  H01J37/32834 ,  H01J37/3411 ,  H01J37/3417 ,  H01J37/3435 ,  H01J37/3438

摘要： A sputtering device includes: a sputtering target; a substrate supporter facing the sputtering target and upon which a substrate is disposed; an anode mask between the sputtering target and the substrate which is on the substrate supporter; and a gas distribution member between the anode mask and the sputtering target, and including a plurality of gas distribution tubes separated from each other. Each gas distribution tube includes a plurality of discharge holes defined therein and through which gas is discharged to a vacuum chamber configured to receive the sputtering device.

摘要翻译： 溅射装置包括：溅射靶; 面向溅射靶的衬底支撑件，并且衬底被设置在衬底支撑件上; 位于所述基板支撑体上的所述溅射靶和所述基板之间的阳极掩模; 以及位于阳极掩模和溅射靶之间的气体分配构件，并且包括彼此分离的多个气体分配管。 每个气体分配管包括限定在其中的多个排放孔，并且气体被排出到被配置为接收溅射装置的真空室。