Invention Application
- Patent Title: SEMICONDUCTOR DEVICE HAVING A FUSE ELEMENT
- Patent Title (中): 具有保险丝元件的半导体器件
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Application No.: US14086268Application Date: 2013-11-21
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Publication No.: US20140077335A1Publication Date: 2014-03-20
- Inventor: Takehiro UEDA
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Priority: JP2003-288829 20030807
- Main IPC: H01L23/525
- IPC: H01L23/525

Abstract:
A portion-to-be-melted of a fuse is surrounded by plates, so that heat to be generated in a meltdown portion of the fuse under current supply can be confined or accumulated in the vicinity of the meltdown portion of the fuse. This makes it possible to facilitate meltdown of the fuse. The meltdown portion of the fuse in a folded form, rather than in a single here a fuse composed of a straight-line form, is more successful in readily concentrating the heat generated in the fuse under current supply into the meltdown portion, and in further facilitating the meltdown of the fuse.
Public/Granted literature
- US09177912B2 Semiconductor device having a fuse element Public/Granted day:2015-11-03
Information query
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