Invention Application
- Patent Title: THERMALLY CONDUCTIVE PLASTIC COMPOSITIONS, EXTRUSION APPARATUS AND METHODS FOR MAKING THERMALLY CONDUCTIVE PLASTICS
- Patent Title (中): 导热塑料组合物，挤压装置和制造导热塑料的方法
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Application No.: US13829225Application Date: 2013-03-14
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Publication No.: US20140080952A1Publication Date: 2014-03-20
- Inventor: Chandrashekar Raman , Bei Xiang , Anand Murugaiah
- Applicant: MOMENTIVE PERFORMANCE MATERIALS INC.
- Main IPC: C08K13/02
- IPC: C08K13/02 ; C08K3/22 ; C08K5/54 ; C08K3/38
Abstract:
A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a metal oxide, and a silane. The filler composition can further comprise other filler components including, for example, glass fiber or glass flake. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.
Public/Granted literature
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