公开(公告)号：US20170225951A1

公开(公告)日：2017-08-10

申请号：US15501625

申请日：2015-09-10

Applicant: Momentive Performance Materials Inc.

Inventor： Kristofer L. Marsh ,  Richard Barry Kaner ,  Anand Murugaiah ,  Hao Qu

IPC: C01B21/064

CPC classification number: C01B21/064 ,  C01P2004/04 ,  C01P2004/24

Abstract: A method for exfoliating and/or dispersing hexagonal boron nitride comprises mixing hexagonal boron nitride with a solvent system comprising at least two solvents. The use of a solvent system with at least two solvents provides improved benefits to the exfoliation process compared to the use of individual solvents.

公开(公告)号：US20140080952A1

公开(公告)日：2014-03-20

申请号：US13829225

申请日：2013-03-14

Applicant: MOMENTIVE PERFORMANCE MATERIALS INC.

Inventor： Chandrashekar Raman ,  Bei Xiang ,  Anand Murugaiah

IPC: C08K13/02 ,  C08K3/22 ,  C08K5/54 ,  C08K3/38

CPC classification number: C08K3/38 ,  B29B7/421 ,  B29B7/482 ,  B29B7/845 ,  B29B7/90 ,  B29C47/0009 ,  B29C47/1081 ,  B29C47/385 ,  B29C47/6031 ,  B29C47/605 ,  B29C47/64 ,  C08J3/203 ,  C08J2369/00 ,  C08J2377/02 ,  C08J2377/06 ,  C08K3/22 ,  C08K5/54 ,  C08K5/5403 ,  C08K5/5425 ,  C08K7/14 ,  C08K9/06 ,  C08K13/02 ,  C08K2003/382 ,  C08K2003/385 ,  C08K2201/001 ,  Y10T428/2991 ,  Y10T428/2995 ,  Y10T428/2996

Abstract: A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a metal oxide, and a silane. The filler composition can further comprise other filler components including, for example, glass fiber or glass flake. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.

Abstract translation: 导热填料组合物和包含这种填料组合物的树脂组合物。 填料组合物包含氮化硼，金属氧化物和硅烷的共混物。 填料组合物还可包含其它填料组分，包括例如玻璃纤维或玻璃薄片。 可以将填料组合物加入到树脂组合物中以提供导​​热树脂，例如导热塑料。

公开(公告)号：US08946333B2

公开(公告)日：2015-02-03

申请号：US13829225

申请日：2013-03-14

Applicant: Momentive Performance Materials Inc.

Inventor： Chandrashekar Raman ,  Bei Xiang ,  Anand Murugaiah

IPC: C08K3/38 ,  C08K3/20 ,  B32B19/04 ,  C08K5/5425 ,  C08K5/54 ,  C08K3/22 ,  C08K13/02 ,  B29C47/64 ,  C08J3/20 ,  B29B7/42 ,  B29B7/48 ,  B29C47/38 ,  B29C47/60 ,  B29C47/00 ,  B29B7/84 ,  B29B7/90

CPC classification number: C08K3/38 ,  B29B7/421 ,  B29B7/482 ,  B29B7/845 ,  B29B7/90 ,  B29C47/0009 ,  B29C47/1081 ,  B29C47/385 ,  B29C47/6031 ,  B29C47/605 ,  B29C47/64 ,  C08J3/203 ,  C08J2369/00 ,  C08J2377/02 ,  C08J2377/06 ,  C08K3/22 ,  C08K5/54 ,  C08K5/5403 ,  C08K5/5425 ,  C08K7/14 ,  C08K9/06 ,  C08K13/02 ,  C08K2003/382 ,  C08K2003/385 ,  C08K2201/001 ,  Y10T428/2991 ,  Y10T428/2995 ,  Y10T428/2996

Abstract: A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a metal oxide, and a silane. The filler composition can further comprise other filler components including, for example, glass fiber or glass flake. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.

Abstract translation: 导热填料组合物和包含这种填料组合物的树脂组合物。 填料组合物包含氮化硼，金属氧化物和硅烷的共混物。 填料组合物还可包含其它填料组分，包括例如玻璃纤维或玻璃薄片。 可以将填料组合物加入到树脂组合物中以提供导​​热树脂，例如导热塑料。