Invention Application
- Patent Title: COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES
- Patent Title (中): 用于金属电镀的组合物，包括用于底部填充硅橡胶和互连特征的添加剂
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Application No.: US14123129Application Date: 2012-05-31
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Publication No.: US20140097092A1Publication Date: 2014-04-10
- Inventor: Cornelia Roeger-Goepfert , Marco Arnold , Alexander Fluegel , Charlotte Emnet , Roman Benedikt Raether , Dieter Mayer
- Applicant: Cornelia Roeger-Goepfert , Marco Arnold , Alexander Fluegel , Charlotte Emnet , Roman Benedikt Raether , Dieter Mayer
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- International Application: PCT/IB2012/052727 WO 20120531
- Main IPC: C25D3/38
- IPC: C25D3/38
Abstract:
A composition comprising a source of metal ions and at least one polyaminoamide, said polyaminoamide comprising amide and amine functional groups in the polymeric backbone and aromatic moieties attached to or located within said polymeric backbone.
Public/Granted literature
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