发明申请
- 专利标题: Buck Converter Power Package
- 专利标题(中): 降压转换器电源包
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申请号: US13666854申请日: 2012-11-01
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公开(公告)号: US20140118032A1公开(公告)日: 2014-05-01
- 发明人: Ling Ma , Andrew N. Sawle , David Paul Jones , Timothy D. Henson , Niraj Ranjan , Vijay Viswanathan , Omar Hassen
- 申请人: Ling Ma , Andrew N. Sawle , David Paul Jones , Timothy D. Henson , Niraj Ranjan , Vijay Viswanathan , Omar Hassen
- 申请人地址: US CA EL SEGUNDO
- 专利权人: INTERNATIONAL RECTIFIER CORPORATION
- 当前专利权人: INTERNATIONAL RECTIFIER CORPORATION
- 当前专利权人地址: US CA EL SEGUNDO
- 主分类号: H02M3/155
- IPC分类号: H02M3/155
摘要:
One exemplary disclosed embodiment comprises a semiconductor package including a vertical conduction control transistor and a vertical conduction sync transistor. The vertical conduction control transistor may include a control source, a control gate, and a control drain that are all accessible from a bottom surface, thereby enabling electrical and direct surface mounting to a support surface. The vertical conduction sync transistor may include a sync drain on a top surface, which may be connected to a conductive clip that is coupled to the support surface. The conductive clip may also be thermally coupled to the control transistor. Accordingly, all terminals of the transistors are readily accessible through the support surface, and a power circuit, such as a buck converter power phase, may be implemented through traces of the support surface. Optionally, a driver IC may be integrated into the package, and a heatsink may be attached to the conductive clip.
公开/授权文献
- US08860194B2 Buck converter power package 公开/授权日:2014-10-14