Systems, methods, and devices are provided to identify the occurrence, location, and/or severity of a fracture within an integrated circuit, even when the integrated circuit is not accessible to external inspection. One such method includes obtaining a measurement of a property of the integrated circuit through at least one contact of the integrated circuit. The measurement may include a resistance of a resistive pattern in the integrated circuit or a measurement of current-voltage behavior of a power supply of the integrated circuit. The measurement of the property may be compared to an expected baseline property. Based at least in part on this comparison, whether a fracture of the integrated circuit has occurred and a location of the fracture in the integrated circuit may be determined.