Invention Application
US20140174911A1 Methods and Systems for Reducing Particles During Physical Vapor Deposition 审中-公开
物理气相沉积过程中减少颗粒的方法和系统

  • Patent Title: Methods and Systems for Reducing Particles During Physical Vapor Deposition
  • Patent Title (中): 物理气相沉积过程中减少颗粒的方法和系统
  • Application No.: US13725846
    Application Date: 2012-12-21
  • Publication No.: US20140174911A1
    Publication Date: 2014-06-26
  • Inventor: Chi-I Lang
  • Applicant: INTERMOLECULAR, INC.
  • Applicant Address: US CA San Jose
  • Assignee: INTERMOLECULAR, INC.
  • Current Assignee: INTERMOLECULAR, INC.
  • Current Assignee Address: US CA San Jose
  • Main IPC: C23C14/35
  • IPC: C23C14/35 H01L21/02
Methods and Systems for Reducing Particles During Physical Vapor Deposition
Abstract:
Embodiments provided herein describe methods and systems for depositing material onto a surface. A target including a material in a porous state is provided. The density of the material in the porous state is less than 89% of the absolute density of the material. The target is positioned over a surface. At least some of the material is caused to be ejected from the target and deposited onto the surface.
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