发明申请
- 专利标题： COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- 专利标题（中）： 半导体器件中的铜线结构及其制造方法
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申请号： US13724006申请日： 2012-12-21
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公开(公告)号： US20140175628A1公开(公告)日： 2014-06-26
- 发明人: Hua Pan , Yueh-Se Ho , Jun Lu , Ming-Chen Lu , Zhiqiang Niu
- 申请人： Hua Pan , Yueh-Se Ho , Jun Lu , Ming-Chen Lu , Zhiqiang Niu
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/00
摘要：
A semiconductor device comprises a first top electrode and a second top electrode at a front surface of the die, at least a Ni plating layer and an Au plating layer overlaying the Ni plating layer are formed on each of the first top electrode and the second top electrode. A copper clip attaches on the Au plating layer of the second top electrode. A gold (Au) stud bump is formed on the Au plating layer of the first top electrode with a copper wire connected on the stud bump. The Au stud bump is thicker than a thickness of the Au plating layer and thinner than a thickness of the copper clip to avoid copper wire NSOP (non-stick on pad) problem due to Ni plating layer diffusion during the solder reflow process in the copper clip attachment.
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