Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
- Patent Title (中): 用于制造半导体器件的半导体器件和方法
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Application No.: US14162364Application Date: 2014-01-23
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Publication No.: US20140209898A1Publication Date: 2014-07-31
- Inventor: Yoshiaki Yamamoto , Koichi Ito , Motomu Kurata , Taiga Muraoka , Daigo Ito
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi
- Priority: JP2013-016182 20130130
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/786

Abstract:
When an oxide semiconductor film is microfabricated to have an island shape, with the use of a hard mask, unevenness of an end portion of the oxide semiconductor film can be suppressed. Specifically, a hard mask is formed over the oxide semiconductor film, a resist is formed over the hard mask, light exposure is performed to form a resist mask, the hard mask is processed using the resist mask as a mask, the oxide semiconductor film is processed using the processed hard mask as a mask, the resist mask and the processed hard mask are removed, a source electrode and a drain electrode are formed in contact with the processed oxide semiconductor film, a gate insulating film is formed over the source electrode and the drain electrode, and a gate electrode is formed over the gate insulating film, the gate electrode overlapping with the oxide semiconductor film.
Public/Granted literature
- US09076825B2 Semiconductor device and method for manufacturing the semiconductor device Public/Granted day:2015-07-07
Information query
IPC分类: