发明申请
- 专利标题： METHODS FOR PROCESSING SUBSTRATES
- 专利标题（中）： 加工基材的方法
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申请号： US14147718申请日： 2014-01-06
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公开(公告)号： US20140210075A1公开(公告)日： 2014-07-31
- 发明人: CHUNGSUN LEE , Jung-Seok AHN , Kwang-chul CHOI , Un-Byoung KANG , Jung-Hwan KIM , JOONSIK SOHN , JEON IL LEE
- 申请人： Samsung Electronics Co., Ltd
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd
- 当前专利权人： Samsung Electronics Co., Ltd
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2013-0008692 20130125
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; H01L21/683
摘要：
A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer.
公开/授权文献
- US09023716B2 Methods for processing substrates 公开/授权日：2015-05-05
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