公开(公告)号：US20140148007A1

公开(公告)日：2014-05-29

申请号：US14170062

申请日：2014-01-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Hwang KIM ,  Sunpil YOUN ,  Sangwon KIM ,  Kwang-chul CHOI ,  Tae Hong MIN

IPC: H01L21/768

CPC classification number: H01L21/76898 ,  H01L21/563 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49816 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A semiconductor device includes a substrate having a first side and a second side such that the first and second sides face each other, a through via plug penetrating the substrate, an insulating film liner, and an antipollution film. The insulating film liner is between the through via plug and the substrate and the insulating film liner has a recessed surface with respect to the second side. The antipollution film covers the second side and the antipollution film is on the recessed surface and between the through via plug and the substrate.

Abstract translation: 半导体器件包括具有第一侧和第二侧的基板，使得第一和第二面彼此面对，贯穿基板的通孔塞，绝缘膜衬垫和防污染膜。 绝缘膜衬垫位于通孔插塞和衬底之间，并且绝缘膜衬套相对于第二侧具有凹陷表面。 防污染膜覆盖第二面，防污染膜位于凹陷表面上，并且在通孔插塞和基底之间。

公开(公告)号：US20150093857A1

公开(公告)日：2015-04-02

申请号：US14566685

申请日：2014-12-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihwan HWANG ,  Young Kun JEE ,  Jung-Hwan KIM ,  Tae Hong MIN ,  Kwang-chul CHOI

IPC: H01L25/00 ,  H01L21/56 ,  H01L23/00 ,  H01L25/18

CPC classification number: H01L25/50 ,  H01L21/56 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3185 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/18 ,  H01L2221/68327 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/00

Abstract: Provided are semiconductor devices and methods of manufacturing the same. The semiconductor package includes a substrate, a first semiconductor chip mounted on the circuit substrate and having a first width, a second semiconductor chip overlying the first semiconductor chip and having a second width greater than the first width, and a first under filler disposed between the first and second semiconductor chips, covering a side surface of the first semiconductor chip and having an inclined side surface.

Abstract translation: 提供半导体器件及其制造方法。 半导体封装包括基板，安装在电路基板上并具有第一宽度的第一半导体芯片，覆盖第一半导体芯片并且具有大于第一宽度的第二宽度的第二半导体芯片，以及设置在第一半导体芯片 第一和第二半导体芯片，覆盖第一半导体芯片的侧表面并具有倾斜的侧表面。

公开(公告)号：US20140210075A1

公开(公告)日：2014-07-31

申请号：US14147718

申请日：2014-01-06

Applicant: Samsung Electronics Co., Ltd

Inventor： CHUNGSUN LEE ,  Jung-Seok AHN ,  Kwang-chul CHOI ,  Un-Byoung KANG ,  Jung-Hwan KIM ,  JOONSIK SOHN ,  JEON IL LEE

IPC: H01L21/304 ,  H01L21/683

CPC classification number: H01L21/6835 ,  B32B37/1284 ,  B32B37/18 ,  B32B37/24 ,  B32B37/26 ,  B32B38/04 ,  B32B38/10 ,  B32B38/162 ,  B32B2037/268 ,  B32B2315/08 ,  B32B2457/14 ,  H01L21/02057 ,  H01L21/02126 ,  H01L21/304 ,  H01L21/6836 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68363 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/13023 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10S438/977 ,  H01L2924/00

Abstract: A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer.

Abstract translation: 一种处理衬底的方法包括：在衬底和载体之间提供接合层，以将衬底粘合到载体上，在衬底由载体支撑的同时处理衬底，以及去除结合层以使衬底与载体分离。 粘合层可以包括热固性剥离层和热固性胶层，其中至少一个热固性胶层设置在热固性剥离层的每一侧上。

公开(公告)号：US20160314996A1

公开(公告)日：2016-10-27

申请号：US15099926

申请日：2016-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： IL HWAN KIM ,  Sang Hyun BAE ,  HYUEKJAE LEE ,  Taeje CHO ,  Kwang-chul CHOI

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B24B7/228

Abstract: The inventive concepts relate to a substrate treating apparatus and a method for treating a substrate using the same. The apparatus includes a spin chuck configured to support a substrate, a grinding head disposed over the spin chuck and configured to grind the substrate supported by the spin chuck, and a nozzle member including a jet nozzle configured to jet high-pressure water to the substrate supported by the spin chuck. The jet nozzle overlaps with the substrate to jet the high-pressure water to an edge of the substrate.

Abstract translation: 本发明的概念涉及基板处理装置和使用其的基板的处理方法。 该装置包括配置成支撑基板的旋转卡盘，设置在旋转卡盘上方并构造成研磨由旋转卡盘支撑的基板的研磨头，以及包括喷射喷嘴的喷嘴构件，该喷嘴构造成将高压水喷射到基板 由旋转卡盘支撑。 喷射喷嘴与基板重叠以将高压水喷射到基板的边缘。

公开(公告)号：US20150214089A1

公开(公告)日：2015-07-30

申请号：US14682231

申请日：2015-04-09

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： CHUNGSUN LEE ,  Jung-Seok AHN ,  Kwang-chul CHOI ,  Un-Byoung KANG ,  Jung-Hwan KIM ,  JOONSIK SOHN ,  JEON IL LEE

IPC: H01L21/683 ,  B32B37/18 ,  B32B37/12 ,  B32B38/10 ,  H01L21/02 ,  B32B38/04 ,  B32B37/24 ,  H01L21/304 ,  H01L21/768 ,  H01L23/00 ,  B32B37/26 ,  B32B38/16

CPC classification number: H01L21/6835 ,  B32B37/1284 ,  B32B37/18 ,  B32B37/24 ,  B32B37/26 ,  B32B38/04 ,  B32B38/10 ,  B32B38/162 ,  B32B2037/268 ,  B32B2315/08 ,  B32B2457/14 ,  H01L21/02057 ,  H01L21/02126 ,  H01L21/304 ,  H01L21/6836 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68363 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/13023 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10S438/977 ,  H01L2924/00

Abstract: A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer.

Abstract translation: 一种处理衬底的方法包括：在衬底和载体之间提供接合层，以将衬底粘合到载体上，在衬底由载体支撑的同时处理衬底，以及去除结合层以使衬底与载体分离。 粘合层可以包括热固性剥离层和热固性胶层，其中至少一个热固性胶层设置在热固性剥离层的每一侧上。