发明申请
- 专利标题： CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- 专利标题（中）： 芯片包装及其形成方法
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申请号： US14260205申请日： 2014-04-23
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公开(公告)号： US20140231966A1公开(公告)日： 2014-08-21
- 发明人: Bai-Yao LOU , Tsang-Yu LIU , Chia-Sheng LIN , Tzu-Hsiang HUNG
- 申请人： XINTEC INC.
- 申请人地址： TW Jhongli City
- 专利权人： XINTEC INC.
- 当前专利权人： XINTEC INC.
- 当前专利权人地址： TW Jhongli City
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/768
摘要：
An embodiment of the invention provides a chip package which includes a substrate having a first surface and a second surface; a conducting pad structure located on the first surface; a dielectric layer located on the first surface of the substrate and the conducting pad structure, wherein the dielectric layer has an opening exposing a portion of the conducting pad structure; and a cap layer located on the dielectric layer and filled into the opening.
公开/授权文献
- US09293394B2 Chip package and method for forming the same 公开/授权日：2016-03-22
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