Invention Application
US20140238045A1 SEMICONDUCTOR DEVICE COMPRISING A STACKED DIE CONFIGURATION INCLUDING AN INTEGRATED PELTIER ELEMENT
有权
包含堆叠式配件的半导体器件，包括集成的PELTIER元件
- Patent Title: SEMICONDUCTOR DEVICE COMPRISING A STACKED DIE CONFIGURATION INCLUDING AN INTEGRATED PELTIER ELEMENT
- Patent Title (中): 包含堆叠式配件的半导体器件，包括集成的PELTIER元件
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Application No.: US14270941Application Date: 2014-05-06
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Publication No.: US20140238045A1Publication Date: 2014-08-28
- Inventor: Uwe Griebenow , Jan Hoentschel , Thilo Scheiper , Sven Beyer
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Priority: DE102010029526.4 20100531
- Main IPC: H01L23/38
- IPC: H01L23/38
Abstract:
A method of controlling temperature in a semiconductor device that includes a stacked device configuration is disclosed. The method includes providing a Peltier element having a metal-based heat sink formed above a first substrate of the stacked device configuration and a metal-based heat source formed above a second substrate of the stacked device configuration, and establishing a current flow through the Peltier element when the semiconductor device is in a specified operating phase.
Public/Granted literature
- US09490189B2 Semiconductor device comprising a stacked die configuration including an integrated peltier element Public/Granted day:2016-11-08
Information query
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