Invention Application
- Patent Title: LIGHT EMITTING DEVICE, LIGHT EMITTING ELEMENT MOUNTING METHOD, AND LIGHT EMITTING ELEMENT MOUNTER
- Patent Title (中): 发光装置，发光元件安装方法和发光元件安装
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Application No.: US14191203Application Date: 2014-02-26
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Publication No.: US20140239331A1Publication Date: 2014-08-28
- Inventor: Takahiro OYU , Tadaaki MIYATA
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Priority: JP2013-037982 20130227
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H01L33/50
Abstract:
Disclosed is a light emitting device including: a light emitting element including an LED chip and a phosphor layer provided at the light emitting side of the LED chip; and a substrate on which the light emitting element is bonded by an adhesive material. The adhesive material is an anisotropic conductive material.
Public/Granted literature
- US09955619B2 Light emitting device, light emitting element mounting method, and light emitting element mounter Public/Granted day:2018-04-24
Information query
