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公开(公告)号：US20240186207A1
公开(公告)日：2024-06-06
申请号：US18441658
申请日：2024-02-14
Applicant: NICHIA CORPORATION
Inventor： Tadaaki MIYATA , Yoshihiro KIMURA , Masatoshi NAKAGAKI
IPC: H01L23/367 , H01L23/373 , H01L23/498
CPC classification number: H01L23/367 , H01L23/3736 , H01L23/49811 , H01L23/49838
Abstract: A method for manufacturing a semiconductor device include: providing a submount that has a first surface, a second surface located on a side opposite the first surface, and at least one lateral surface located between the first surface and the second surface, the submount including: a groove located at the second surface, a heat dissipation portion located at the second surface, at least one end face through channel located at the at least one lateral surface, and an electrode pattern on the first surface; physically joining the heat dissipation portion to a package substrate by a first joint material; and after the step of physically joining the heat dissipation portion to the package substrate, disposing a second joint material inside the at least one end face through channel to electrically connect the electrode pattern and the package substrate.
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公开(公告)号：US20230085464A1
公开(公告)日：2023-03-16
申请号：US17988848
申请日：2022-11-17
Applicant: NICHIA CORPORATION
Inventor： Tadaaki MIYATA , Yoshihiro KIMURA
IPC: H01S5/02257 , C03C4/00 , C03C27/06 , H01S5/02216
Abstract: A light source device includes: a plurality of laser diodes that includes a first laser diode for emitting laser light of red color, a second laser diode for emitting laser light of green color, and a third laser diode for emitting laser light of blue color; a substrate directly or indirectly supporting the plurality of laser diodes; and a cap secured to the substrate and covering the plurality of laser diodes. The cap includes: a first glass portion configured to transmit the laser light that is emitted from the plurality of laser diodes, and a second glass portion. At least one of the first glass portion and the second glass portion comprises an alkaline glass region. The first glass portion and the second glass portion are bonded together via an electrically conductive layer that is in contact with the alkaline glass region. The first glass portion is bonded to the substrate.
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公开(公告)号：US20220013429A1
公开(公告)日：2022-01-13
申请号：US17368608
申请日：2021-07-06
Applicant: NICHIA CORPORATION
Inventor： Tadaaki MIYATA , Yoshihiro KIMURA , Masatoshi NAKAGAKI
IPC: H01L23/367 , H01L23/498 , H01L23/373
Abstract: A semiconductor device includes: a semiconductor element; a submount on which the semiconductor element is mounted, wherein the submount has a first surface on which the semiconductor element is mounted, a second surface located on a side opposite the first surface, and a lateral surface located between the first surface and the second surface, and wherein the submount comprises: a groove located at the second surface, a heat dissipation portion located at the second surface, and an electrode pattern located at the first surface; a package substrate on which the submount is mounted; a first joint member that physically joins the heat dissipation portion to the package substrate; and a connection portion located on the side surface, wherein the connection portion electrically connects the electrode pattern and the package substrate, and the connection portion comprises a second joint member.
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公开(公告)号：US20190097381A1
公开(公告)日：2019-03-28
申请号：US16144316
申请日：2018-09-27
Applicant: NICHIA CORPORATION
Inventor： Tadaaki MIYATA
Abstract: There is provided a light source device comprising a substrate; a semiconductor laser placed on the substrate; a side wall portion formed so as to surround the semiconductor laser; and a cover being translucent, configured to cover a space surrounded by the substrate and the side wall portion, wherein the side wall portion includes a lower surface connected to an upper surface of the substrate over a whole periphery, an upper surface connected to a lower surface of the cover over a whole periphery, and inner side surfaces inclined so that the space expands from a lower surface side to an upper surface side of the side wall portion, at least a part of the inner side surfaces serving as a reflection surface for reflecting a beam emitted from the semiconductor laser toward the cover, and a connecting portion where an upper surface of the substrate and a lower surface of the side wall portion are in contact with each other via a connecting layer is provided in a region corresponding to an upper surface of the side wall portion in a plan view from above.
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公开(公告)号：US20170287883A1
公开(公告)日：2017-10-05
申请号：US15623211
申请日：2017-06-14
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi MARUTANI , Hiroto TAMAKI , Tadaaki MIYATA
IPC: H01L25/075
CPC classification number: H01L25/0753 , F21K9/27 , F21Y2103/10 , F21Y2115/10 , H01L33/50 , H01L33/60 , H01L33/62 , H01L2224/16
Abstract: A method of manufacturing a light-emitting device includes steps of: preparing at least one substrate having a plurality of through holes; providing an electric wire on a rear surface side of the substrate so that a plurality of portions of the electric wire communicates with a front surface side of the substrate at the plurality of through holes of the substrate; and respectively mounting a plurality of light-emitting diodes to the respective portions of the electric wire that communicate with the front surface side of the substrate.
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Patent Agency Ranking
公开(公告)号：US20160087169A1
公开(公告)日：2016-03-24
申请号：US14956804
申请日：2015-12-02
Applicant: NICHIA CORPORATION
Inventor： Motokazu YAMADA , Tadaaki MIYATA , Naoki MORI
CPC classification number: H01L33/56 , F21S4/22 , F21Y2101/00 , F21Y2103/00 , F21Y2103/10 , F21Y2115/10 , H01L25/0753 , H01L27/15 , H01L33/32 , H01L33/483 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16225 , H01L2224/73204 , H05K1/111 , H05K1/189 , H05K2201/09363 , H05K2201/10106
Abstract: A light emitting device includes a substrate, a light emitting device and a sealing resin member. The substrate includes a flexible base, a plurality of wiring portions, a groove portion and a pair of terminal portions. The flexible base extends in a first direction corresponding to a longitudinal direction of the substrate and the plurality of wiring portions are arranged on the flexible base. The groove portion is formed between the plurality of wiring portions spaced apart from each other. The pair of terminal portions is arranged along the first direction at the both sides of the plurality of wiring portions. The light emitting element is disposed on the substrate and electrically connected to the plurality of wiring portions. The sealing resin member seals the light emitting element and a part of the substrate. The light emitting element is mounted on the substrate in a flip-chip manner.
Abstract translation: 发光器件包括衬底，发光器件和密封树脂构件。 基板包括柔性基座，多个布线部分，槽部分和一对端子部分。 柔性基部沿着与基板的纵向相对应的第一方向延伸，并且多个布线部布置在柔性基部上。 槽部形成在彼此间隔开的多个配线部之间。 一对端子部分沿着第一方向布置在多个布线部分的两侧。 发光元件设置在基板上并电连接到多个布线部分。 密封树脂构件密封发光元件和基板的一部分。 发光元件以倒装芯片方式安装在基板上。
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公开(公告)号：US20150236230A1
公开(公告)日：2015-08-20
申请号：US14625167
申请日：2015-02-18
Applicant: Nichia Corporation
Inventor： Tadaaki MIYATA
CPC classification number: H01L33/62 , H01L33/0095 , H01L33/48 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/181 , H01L2933/0033 , H01L2933/0066 , H01L2924/00012 , H01L2924/00
Abstract: A light-emitting device includes a support including a substrate, a pair of electrodes and an insulating reflective member, the pair of electrodes being disposed on an upper surface of the substrate, and the reflective member being disposed on the substrate, a light-emitting element flip-chip mounted on the pair of electrodes, and a resin member disposed at least between the light-emitting element and the reflective member, the resin member including a conductive substance which electrically connects the light-emitting element to the pair of electrodes, the reflective member being disposed at least over an entirety of a surface that is located immediately below the resin member.
Abstract translation: 发光装置包括：支撑体，其包括基板，一对电极和绝缘反射构件，所述一对电极设置在所述基板的上表面上，所述反射构件设置在所述基板上，发光 安装在所述一对电极上的元件倒装芯片，以及至少设置在所述发光元件和所述反射构件之间的树脂构件，所述树脂构件包括将所述发光元件电连接到所述一对电极的导电物质， 该反射构件至少设置在位于树脂构件正下方的整个表面上。
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公开(公告)号：US20230291172A1
公开(公告)日：2023-09-14
申请号：US18314590
申请日：2023-05-09
Applicant: NICHIA CORPORATION
Inventor： Tadaaki MIYATA , Yoshihiro KIMURA
IPC: H01S5/02257 , C03C4/00 , C03C27/06 , H01S5/02216
CPC classification number: H01S5/02257 , C03C4/0071 , C03C27/06 , H01S5/02216 , C03C2204/00
Abstract: A light source device includes: a laser diode configured to emit laser light; a substrate directly or indirectly supporting the laser diode; and a cap secured to the substrate and covering the laser diode, the cap including: a first portion configured to transmit the laser light that is emitted from the laser diode, and a second portion that is bonded to the first portion. The second portion includes: a pair of lateral wall portions that are located at lateral sides of the laser diode, the pair of lateral wall portions being bonded to the first portion, a cover portion that is located above the laser diode and connects the pair of lateral wall portions together, and a rear wall portion that faces the first portion with the laser diode disposed between the first portion and the rear wall portion of the second portion.
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公开(公告)号：US20230204194A1
公开(公告)日：2023-06-29
申请号：US17996339
申请日：2021-03-19
Applicant: NICHIA CORPORATION
Inventor： Tadaaki MIYATA
IPC: F21V19/00
CPC classification number: F21V19/0015 , F21Y2115/30
Abstract: A light source device 100 includes a first substrate 10 having a first mounting surface 10a, a second substrate 11 having a second mounting surface 11a that opposes the first mounting surface, a first laser diode 30a directly or indirectly supported by the first mounting surface, a second laser diode 30b directly or indirectly supported by the first mounting surface, and a third laser diode 30c directly or indirectly supported by the second mounting surface. The emission point of the third laser diode is positioned between the emission point of the first laser diode and the emission point of the second laser diode in the width direction, and in a plan view, when viewed in the direction perpendicular to the first mounting surface, at least one the first laser diode and the second laser diode at least partially overlaps the third laser diode.
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公开(公告)号：US20230187899A1
公开(公告)日：2023-06-15
申请号：US18065587
申请日：2022-12-13
Applicant: NICHIA CORPORATION
Inventor： Shota MURAKAMI , Norikazu YANO , Tadaaki MIYATA
IPC: H01S5/0237 , B23K1/00
CPC classification number: H01S5/0237 , B23K1/0016 , B23K35/3013
Abstract: A manufacturing method of a light-emitting device includes: preparing a mounting substrate having a mounting surface, the mounting substrate including a first metal pattern arranged on a mounting surface side, a second metal pattern arranged on the mounting surface side inward of the first metal pattern in a plan view, and a third metal pattern arranged on the mounting surface side outward of the first metal pattern in the plan view; arranging a light-emitting element over the mounting surface of the mounting substrate; applying a bonding material to the first metal pattern; and joining a sealing member to at least the first metal pattern of the mounting substrate via the bonding material, the sealing member including a fourth metal pattern with a width greater than or equal to a width of the first metal pattern.
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