An embedded chip package structure including a core layer, a chip, a first circuit layer and a second circuit layer is provided. The core layer includes a first surface, a second surface opposite to each other and a chip container passing through the first surface and the second surface. The chip is disposed in the chip container. The chip includes an active surface and a protrusion and a top surface of the protrusion is a part of the active surface. The first circuit layer is disposed on the first surface and electrically connected to the core layer and the chip. The first circuit layer has a through hole. The protrusion of the chip is situated within the through hole, and the top surface of the protrusion is exposed to receive an external signal. The second circuit layer is disposed on the second surface and electrically connected to the core layer.