Invention Application
US20140272455A1 Titanium nickel niobium alloy barrier for low-emissivity coatings
审中-公开
用于低辐射涂层的钛镍铌合金屏障
- Patent Title: Titanium nickel niobium alloy barrier for low-emissivity coatings
- Patent Title (中): 用于低辐射涂层的钛镍铌合金屏障
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Application No.: US13797504Application Date: 2013-03-12
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Publication No.: US20140272455A1Publication Date: 2014-09-18
- Inventor: Guowen Ding , Brent Boyce , Jeremy Cheng , Muhammad Imran , Jingyu Lao , Minh Huu Le , Daniel Schweigert , Zhi-Wen Wen Sun , Yu Wang , Yongli Xu , Guizhen Zhang
- Applicant: INTERMOLECULAR INC.
- Applicant Address: US CA San Jose
- Assignee: INTERMOLECULAR INC.
- Current Assignee: INTERMOLECULAR INC.
- Current Assignee Address: US CA San Jose
- Main IPC: G02B1/10
- IPC: G02B1/10 ; C23C14/08 ; C23C14/14
Abstract:
A method for making low emissivity panels, including control the composition of a barrier layer formed on a thin conductive silver layer. The barrier structure can include a ternary alloy of titanium, nickel and niobium, which showed improvements in overall performance than those from binary barrier results. The percentage of titanium can be between 5 and 15 wt %. The percentage of nickel can be between 30 and 50 wt %. The percentage of niobium can be between 40 and 60 wt %.
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