A printed circuit board and a method of mounting an integrated circuit packaging component on the same are provided. The printed circuit board includes a substrate and a plurality of conductive contacts arranged on a surface of the substrate. Each of the conductive contacts has a soldering material layer formed on a top surface thereof, and a concave portion formed on the soldering material layer. Each of the concave portions is aligned with a vertex of the ball-conducting joint for allowing a vertex of the ball conducting joint to extend into the concave portion.