公开(公告)号：US20140284080A1

公开(公告)日：2014-09-25

申请号：US14086856

申请日：2013-11-21

Applicant: Tech-Front (shanghai) Computer Co. Ltd. ,  Quanta Computer Inc.

Inventor： Jing ZHANG ,  Jin-Chang WU ,  Xiao-Feng XIE

IPC: H05K1/11 ,  H05K13/04

CPC classification number: H05K3/3436 ,  H05K3/1233 ,  H05K3/14 ,  H05K3/3484 ,  H05K2201/10734 ,  H05K2203/0465 ,  Y02P70/613

Abstract: A printed circuit board and a method of mounting an integrated circuit packaging component on the same are provided. The printed circuit board includes a substrate and a plurality of conductive contacts arranged on a surface of the substrate. Each of the conductive contacts has a soldering material layer formed on a top surface thereof, and a concave portion formed on the soldering material layer. Each of the concave portions is aligned with a vertex of the ball-conducting joint for allowing a vertex of the ball conducting joint to extend into the concave portion.

Abstract translation: 提供印刷电路板和将集成电路封装部件安装在其上的方法。 印刷电路板包括基板和布置在基板的表面上的多个导电触点。 每个导电触点具有形成在其顶表面上的焊接材料层和形成在焊接材料层上的凹部。 每个凹部与球形导电接头的顶点对准，用于允许球导电接头的顶点延伸到凹部中。