发明申请
- 专利标题: SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- 专利标题(中): 半导体封装及其制造方法
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申请号: US14011930申请日: 2013-08-28
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公开(公告)号: US20140284795A1公开(公告)日: 2014-09-25
- 发明人: Sang Eun LEE , Chang Il KIM
- 申请人: SK hynix Inc.
- 申请人地址: KR Icheon-si Gyeonggi-do
- 专利权人: SK hynix Inc.
- 当前专利权人: SK hynix Inc.
- 当前专利权人地址: KR Icheon-si Gyeonggi-do
- 优先权: KR10-2013-0029536 20130320
- 主分类号: H01L23/00
- IPC分类号: H01L23/00
摘要:
Various embodiments are directed to a semiconductor package and a method for manufacturing the same. A semiconductor package includes the following: a substrate having a plurality of connection pads; a semiconductor chip provided with a plurality of bonding pads on a first surface thereof and attached onto the substrate in a face-down position so that the bonding pads are positioned right above the corresponding connection pads; and thermoplastic conductive members introduced between the substrate and the semiconductor chip such that the bonding pad and the corresponding connection pad may be electrically connected.