Invention Application
- Patent Title: Substrate Treating Apparatus
- Patent Title (中): 基板处理装置
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Application No.: US14187556Application Date: 2014-02-24
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Publication No.: US20140291421A1Publication Date: 2014-10-02
- Inventor: SeokHoon Kim , Yongmyung Jun , Yongsun Ko , Kyoungseob Kim , Jung-Min Oh , Kuntack Lee , Jihoon Jeong , Yong-Jhin Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR10-2013-0032249 20130326
- Main IPC: B05B1/14
- IPC: B05B1/14

Abstract:
Provided is a substrate treating apparatus including a housing; a plurality of opening-and-closing members configured to provide a driving force for opening and closing the housing; a fluid storing member supplying a fluid to the opening-and-closing members; and a fluid distribution unit connected to the fluid storing member via a supply conduit to distribute the fluid supplied from the fluid storing member to the opening-and-closing members. The fluid distribution unit includes a distribution conduit diverging from the supply conduit and connected to a corresponding one of the opening-and-closing members; and a fluid distribution member provided at a junction between the supply conduit and the distribution conduit.
Public/Granted literature
- US09627233B2 Substrate treating apparatus Public/Granted day:2017-04-18
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