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    Substrate Treating Apparatus
    6.
    发明申请
    Substrate Treating Apparatus 有权
    基板处理装置

    公开(公告)号：US20140291421A1

    公开(公告)日：2014-10-02

    申请号：US14187556

    申请日：2014-02-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： SeokHoon Kim ,  Yongmyung Jun ,  Yongsun Ko ,  Kyoungseob Kim ,  Jung-Min Oh ,  Kuntack Lee ,  Jihoon Jeong ,  Yong-Jhin Cho

    IPC: B05B1/14

    CPC classification number: H01L21/6708 ,  H01L21/67017 ,  H01L21/67051

    Abstract: Provided is a substrate treating apparatus including a housing; a plurality of opening-and-closing members configured to provide a driving force for opening and closing the housing; a fluid storing member supplying a fluid to the opening-and-closing members; and a fluid distribution unit connected to the fluid storing member via a supply conduit to distribute the fluid supplied from the fluid storing member to the opening-and-closing members. The fluid distribution unit includes a distribution conduit diverging from the supply conduit and connected to a corresponding one of the opening-and-closing members; and a fluid distribution member provided at a junction between the supply conduit and the distribution conduit.

    Abstract translation: 提供一种基板处理装置，包括壳体; 多个打开和关闭构件，其构造成提供用于打开和关闭壳体的驱动力; 向开闭部件供给流体的流体存储部件; 以及流体分配单元，其经由供应管道连接到流体存储构件，以将从流体存储构件供应的流体分配到打开和关闭构件。 流体分配单元包括从供应导管分支并连接到相应的一个打开和关闭构件的分配管道; 以及设置在供应管道和分配管道之间的接合处的流体分配构件。

    Process chamber and substrate processing apparatus including the same
    7.
    发明授权
    Process chamber and substrate processing apparatus including the same 有权

    公开(公告)号：US11610788B2

    公开(公告)日：2023-03-21

    申请号：US17217417

    申请日：2021-03-30

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yong-Jhin Cho ,  Young-Hoo Kim ,  Jihoon Jeong ,  Yungjun Kim ,  Jung-Min Oh ,  Kuntack Lee ,  Hyosan Lee

    IPC: H01L21/67 ,  H01L21/02

    Abstract: A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.

    Process chamber and substrate processing apparatus including the same
    9.
    发明授权
    Process chamber and substrate processing apparatus including the same 有权

    公开(公告)号：US10991600B2

    公开(公告)日：2021-04-27

    申请号：US15848481

    申请日：2017-12-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yong-Jhin Cho ,  Young-Hoo Kim ,  Jihoon Jeong ,  Yungjun Kim ,  Jung-Min Oh ,  Kuntack Lee ,  Hyosan Lee

    IPC: H01L21/67 ,  H01L21/02

    Abstract: A process chamber and a substrate processing apparatus including the same are disclosed. The process chamber includes a first housing and a second housing on the first housing. The first housing includes a first outer wall, a first partition wall facing the first outer wall, and a first side wall connecting the first outer wall and the first partition wall. The second housing includes a second outer wall, a second partition wall between the second outer wall and the first partition wall, and a second side wall connecting the second outer wall and the second partition wall. Each of the first and second outer walls has a thickness greater than a thickness of the first partition wall and a thickness of the second partition wall.

    MANUFACTURING METHOD AND FLUID SUPPLY SYSTEM FOR TREATING SUBSTRATE
    10.
    发明申请
    MANUFACTURING METHOD AND FLUID SUPPLY SYSTEM FOR TREATING SUBSTRATE 审中-公开
    用于处理基板的制造方法和流体供应系统

    公开(公告)号：US20170062208A1

    公开(公告)日：2017-03-02

    申请号：US15350983

    申请日：2016-11-14

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jung-Min Oh ,  HyoSan Lee ,  YongSun Ko ,  KyoungSeob Kim ,  SeokHoon Kim ,  KunTack Lee ,  YongMyung Jun ,  Yong-Jhin Cho

    IPC: H01L21/02 ,  H01L21/308 ,  H01L21/67

    CPC classification number: H01L21/02101 ,  H01L21/3081 ,  H01L21/67017 ,  H01L21/67034 ,  H01L21/67109 ,  H01L21/67253

    Abstract: A method of manufacture and fluid supply system for treating a substrate is provided. The fluid supply system for treating a substrate may include a substrate dry part supplying a dry fluid to dry a rinse solution doped on a substrate; a dry fluid separation part retrieving a mixed fluid that the dry fluid and the rinse solution are mixed with each other during a dry process of the substrate from the substrate dry part and separating the dry fluid from the mixed fluid; and a dry fluid supply part resupplying the dry fluid separated from the dry fluid separation part to the substrate dry part.

    Abstract translation: 提供了一种用于处理基板的制造方法和流体供应系统。 用于处理基底的流体供应系统可以包括：供给干燥流体以干燥掺杂在基底上的漂洗溶液的基底干燥部分; 干燥流体分离部件，其在从所述基材干燥部分干燥所述基材的干燥过程期间将所述干燥流体和所述冲洗溶液彼此混合的混合流体，并将所述干燥流体与所述混合流体分离; 以及将干燥流体分离部分分离的干燥流体再供给到基板干燥部分的干燥流体供给部件。

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