Invention Application
US20140311653A1 JOINING DEVICE AND JOINING POSITION ADJUSTMENT METHOD USING JOINING DEVICE
有权
使用加工装置的加工装置和加工位置调整方法
- Patent Title: JOINING DEVICE AND JOINING POSITION ADJUSTMENT METHOD USING JOINING DEVICE
- Patent Title (中): 使用加工装置的加工装置和加工位置调整方法
-
Application No.: US14351425Application Date: 2012-09-13
-
Publication No.: US20140311653A1Publication Date: 2014-10-23
- Inventor: Michikazu Nakamura , Masahiko Sugiyama , Hajime Furuya , Naoki Akiyama , Yosuke Omori
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Priority: JP2011-231672 20111021; JP2012-124522 20120531
- International Application: PCT/JP2012/074129 WO 20120913
- Main IPC: H01L21/68
- IPC: H01L21/68

Abstract:
A joining device includes a first holding unit configured to load and hold the first member on its top surface; a second holding unit disposed above the first holding unit while facing the first holding unit and configured to hold the second member; and a position adjustment mechanism configured to adjust a joining position between the first member held by the first holding unit and the second member held by the second holding unit. The second holding unit is of a circular plate shape, and the position adjustment mechanism includes four position-adjusting cam members disposed at equal intervals along an outer peripheral surface of the second holding unit, and moves the second holding unit in a horizontal direction.
Public/Granted literature
- US09263312B2 Joining device and joining position adjustment method using joining device Public/Granted day:2016-02-16
Information query
IPC分类: