公开(公告)号：US20230026661A1

公开(公告)日：2023-01-26

申请号：US17936068

申请日：2022-09-28

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Yosuke Omori

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683 ,  H01L21/20 ,  B23K20/00 ,  H01L21/02

Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.

公开(公告)号：US20140311653A1

公开(公告)日：2014-10-23

申请号：US14351425

申请日：2012-09-13

Applicant: Tokyo Electron Limited

Inventor： Michikazu Nakamura ,  Masahiko Sugiyama ,  Hajime Furuya ,  Naoki Akiyama ,  Yosuke Omori

IPC: H01L21/68

CPC classification number: H01L21/68 ,  H01L21/67092 ,  Y10T156/1744

Abstract: A joining device includes a first holding unit configured to load and hold the first member on its top surface; a second holding unit disposed above the first holding unit while facing the first holding unit and configured to hold the second member; and a position adjustment mechanism configured to adjust a joining position between the first member held by the first holding unit and the second member held by the second holding unit. The second holding unit is of a circular plate shape, and the position adjustment mechanism includes four position-adjusting cam members disposed at equal intervals along an outer peripheral surface of the second holding unit, and moves the second holding unit in a horizontal direction.

Abstract translation: 接合装置包括：第一保持单元，其构造成在其顶表面上加载和保持第一构件; 第二保持单元，其设置在所述第一保持单元的上方，同时面向所述第一保持单元并且构造成保持所述第二构件; 以及位置调整机构，其构造成调整由所述第一保持单元保持的所述第一构件与由所述第二保持单元保持的所述第二构件之间的接合位置。 第二保持单元是圆板形状，并且位置调节机构包括沿着第二保持单元的外周表面等间隔设置的四个位置调节凸轮构件，并且使第二保持单元沿水平方向移动。

公开(公告)号：US11482431B2

公开(公告)日：2022-10-25

申请号：US16964008

申请日：2019-01-11

Applicant: Tokyo Electron Limited

Inventor： Kimio Motoda ,  Norifumi Kohama ,  Norio Wada ,  Yosuke Omori ,  Kenji Sugakawa

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687

Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.

公开(公告)号：US10985132B2

公开(公告)日：2021-04-20

申请号：US16928814

申请日：2020-07-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yoshitaka Otsuka ,  Takashi Nakamitsu ,  Yosuke Omori ,  Kenji Sugakawa

IPC: B32B41/00 ,  H01L23/00 ,  H01L21/677 ,  H01L21/67 ,  H01L21/683 ,  B32B15/01 ,  H01L21/18 ,  H01L21/20 ,  H01L21/68 ,  B32B37/10 ,  B32B37/00

Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

公开(公告)号：US20240006207A1

公开(公告)日：2024-01-04

申请号：US18341903

申请日：2023-06-27

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Tetsuya Maki ,  Yosuke Omori ,  Keiichi Saiki

IPC: H01L21/67 ,  H01L21/18 ,  H01L21/68 ,  H01L21/683

CPC classification number: H01L21/67259 ,  H01L21/67017 ,  H01L21/187 ,  H01L21/681 ,  H01L21/6838

Abstract: A bonding apparatus includes a first holder; a second holder; a horizontally moving unit; an elevating unit; an inclination measuring unit; and a controller. The first holder is configured to attract and hold a first substrate on a bottom surface thereof. The second holder is disposed under the first holder and configured to attract and hold a second substrate on a top surface thereof. The horizontally moving unit is configured to move the first substrate and the second substrate relative to each other in a horizontal direction. The elevating unit is configured to move the second substrate up and down between a proximate position and a spaced position. The inclination measuring unit is configured to measure an inclination of the second holder. The controller calculates a position of the second substrate in the horizontal direction based on a measurement result of the inclination measuring unit.

公开(公告)号：US11735465B2

公开(公告)日：2023-08-22

申请号：US16962680

申请日：2019-01-09

Applicant: Tokyo Electron Limited

Inventor： Kenji Sugakawa ,  Yosuke Omori

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/67092 ,  H01L21/68 ,  H01L21/6875 ,  H01L21/68742

Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including, as multiple regions in which attracting pressures for attracting the substrate are controlled independently, a first region having a circular shape and a second region having an annular shape and disposed at an outside of the first region in a diametrical direction; multiple attracting pressure generators configured to independently generate the attracting pressures respectively in the multiple regions forming the attraction surface; multiple attracting pressure adjusters configured to independently adjust the attracting pressures respectively generated by the attracting pressure generators; and a controller configured to control the multiple attracting pressure generators and the multiple attracting pressure adjusters. The controller generates different attracting pressures in at least a part of the first region and in at least a part of the second region.

公开(公告)号：US10756046B2

公开(公告)日：2020-08-25

申请号：US16553530

申请日：2019-08-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yoshitaka Otsuka ,  Takashi Nakamitsu ,  Yosuke Omori ,  Kenji Sugakawa

IPC: B32B41/00 ,  H01L23/00 ,  H01L21/677 ,  H01L21/67 ,  H01L21/683 ,  B32B15/01 ,  H01L21/18 ,  H01L21/20 ,  H01L21/68 ,  B32B37/10 ,  B32B37/00

Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

公开(公告)号：US20190385971A1

公开(公告)日：2019-12-19

申请号：US16556409

申请日：2019-08-30

Applicant: Tokyo Electron Limited

Inventor： Yosuke Omori ,  Kenji Sugakawa

IPC: H01L23/00

Abstract: Deformation of substrates after the substrates are bonded can be suppressed. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit provided under the first holding unit and configured to attract and hold a second substrate from below; and a striker configured to press a central portion of the first substrate from above and bring the first substrate into contact with the second substrate. The first holding unit is configured to attract and hold a partial region of a peripheral portion of the first substrate, and the first holding unit attracts and holds the region which intersects with a direction, among directions from the central portion of the first substrate toward the peripheral portion thereof, in which a bonding region between the first substrate and the second substrate is expanded faster.

公开(公告)号：US10438918B2

公开(公告)日：2019-10-08

申请号：US15670072

申请日：2017-08-07

Applicant: Tokyo Electron Limited

Inventor： Yosuke Omori ,  Kenji Sugakawa

IPC: B32B37/00 ,  H01L23/00 ,  H01L21/67 ,  H01L21/20 ,  H01L21/64

Abstract: Deformation of substrates after the substrates are bonded can be suppressed. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit provided under the first holding unit and configured to attract and hold a second substrate from below; and a striker configured to press a central portion of the first substrate from above and bring the first substrate into contact with the second substrate. The first holding unit is configured to attract and hold a partial region of a peripheral portion of the first substrate, and the first holding unit attracts and holds the region which intersects with a direction, among directions from the central portion of the first substrate toward the peripheral portion thereof, in which a bonding region between the first substrate and the second substrate is expanded fastest.

公开(公告)号：US20190273063A1

公开(公告)日：2019-09-05

申请号：US16347868

申请日：2017-10-11

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Yosuke Omori

IPC: H01L23/00 ,  H01L21/68 ,  H01L21/67 ,  H01L21/683

Abstract: A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.