- 专利标题: FINFET DEVICES CONTAINING MERGED EPITAXIAL FIN-CONTAINING CONTACT REGIONS
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申请号: US13865519申请日: 2013-04-18
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公开(公告)号: US20140312419A1公开(公告)日: 2014-10-23
- 发明人: Thomas N. Adam , Veeraraghavan S. Basker , Jinghong Li , Chung-Hsun Lin , Sebastian Naczas , Alexander Reznicek , Tenko Yamashita
- 申请人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L27/12
- IPC分类号: H01L27/12 ; H01L29/66
摘要:
A plurality of semiconductor fins are formed which extend from a semiconductor material portion that is present atop an insulator layer of a semiconductor-on-insulator substrate. A gate structure and adjacent gate spacers are formed that straddle each semiconductor fin. Portions of each semiconductor fin are left exposed. The exposed portions of the semiconductor fins are then merged by forming an epitaxial semiconductor material from an exposed semiconductor material portion that is not covered by the gate structure and gate spacers.
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