发明申请
- 专利标题： SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体器件
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申请号： US14461222申请日： 2014-08-15
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公开(公告)号： US20140357075A1公开(公告)日： 2014-12-04
- 发明人: Thorsten Meyer , Recai Sezi , Markus Brunnbauer
- 申请人： Thorsten Meyer , Recai Sezi , Markus Brunnbauer
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
A semiconductor device includes a semiconductor chip and a metal layer electrically coupled to the semiconductor chip. The semiconductor device includes an array of solder balls coupled to the metal layer and a front side protect material directly contacting the metal layer and laterally surrounding a portion of at least a plurality of solder balls. The front side protect material is configured to become fluid during solder reflow.
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