公开(公告)号：US09093322B2

公开(公告)日：2015-07-28

申请号：US11777694

申请日：2007-07-13

申请人： Thorsten Meyer ,  Markus Brunnbauer ,  Recai Sezi

发明人： Thorsten Meyer ,  Markus Brunnbauer ,  Recai Sezi

IPC分类号： H01L23/48 ,  H01L23/00 ,  B81C1/00 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L24/12 ,  B81B2207/07 ,  B81B2207/097 ,  B81C1/00301 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/02311 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/013

摘要： A semiconductor device is disclosed. One embodiment includes a semiconductor substrate and at least two insulating elements located above the semiconductor substrate or above a mold compound embedding the semiconductor substrate. The at least two insulating elements have a first face facing the semiconductor substrate or the mold compound and a second face facing away from the semiconductor substrate or the mold compound. A conductive element for each of the at least two insulating elements extends from the first face of the insulating element to the second face of the insulating element.

摘要翻译： 公开了一种半导体器件。 一个实施例包括半导体衬底和位于半导体衬底之上或在嵌入半导体衬底的模具化合物上方的至少两个绝缘元件。 所述至少两个绝缘元件具有面对半导体衬底或模具化合物的第一面和背离半导体衬底或模具化合物的第二面。 用于至少两个绝缘元件中的每一个的导电元件从绝缘元件的第一面延伸到绝缘元件的第二面。

公开(公告)号：US20140332937A1

公开(公告)日：2014-11-13

申请号：US14330066

申请日：2014-07-14

申请人： Markus Brunnbauer ,  Thorsten Meyer ,  Stephan Bradl ,  Ralf Plieninger ,  Jens Pohl ,  Klaus Pressel ,  Recai Sezi

发明人： Markus Brunnbauer ,  Thorsten Meyer ,  Stephan Bradl ,  Ralf Plieninger ,  Jens Pohl ,  Klaus Pressel ,  Recai Sezi

IPC分类号： H01L23/60 ,  H01L23/48

CPC分类号： H01L25/50 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/60 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1617 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00

摘要： A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer.

摘要翻译： 工件具有至少两个半导体芯片，每个半导体芯片具有至少部分暴露的第一主表面和第二主表面。 所述工件还包括布置在所述至少两个半导体芯片上的导电层，所述导电层至少布置在所述第二主表面的区域上，所述模制化合物布置在所述导电层上。

公开(公告)号：US20140357075A1

公开(公告)日：2014-12-04

申请号：US14461222

申请日：2014-08-15

申请人： Thorsten Meyer ,  Recai Sezi ,  Markus Brunnbauer

发明人： Thorsten Meyer ,  Recai Sezi ,  Markus Brunnbauer

IPC分类号： H01L23/00

CPC分类号： H01L24/11 ,  H01L24/27 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/116 ,  H01L2224/1183 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/27462 ,  H01L2224/73104 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014

摘要： A semiconductor device includes a semiconductor chip and a metal layer electrically coupled to the semiconductor chip. The semiconductor device includes an array of solder balls coupled to the metal layer and a front side protect material directly contacting the metal layer and laterally surrounding a portion of at least a plurality of solder balls. The front side protect material is configured to become fluid during solder reflow.

摘要翻译： 半导体器件包括电连接到半导体芯片的半导体芯片和金属层。 半导体器件包括耦合到金属层的焊料球阵列和直接接触金属层并横向围绕至少多个焊球的一部分的前侧保护材料。 正面保护材料配置成在回流焊时成为流体。

公开(公告)号：US08309454B2

公开(公告)日：2012-11-13

申请号：US11746936

申请日：2007-05-10

申请人： Markus Brunnbauer ,  Thorsten Meyer ,  Stephan Bradl ,  Ralf Plieninger ,  Jens Pohl ,  Klaus Pressel ,  Recai Sezi

发明人： Markus Brunnbauer ,  Thorsten Meyer ,  Stephan Bradl ,  Ralf Plieninger ,  Jens Pohl ,  Klaus Pressel ,  Recai Sezi

IPC分类号： H01L21/4763

CPC分类号： H01L25/50 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/60 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1617 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00

摘要： A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer.

摘要翻译： 工件具有至少两个半导体芯片，每个半导体芯片具有至少部分暴露的第一主表面和第二主表面。 所述工件还包括布置在所述至少两个半导体芯片上的导电层，所述导电层至少布置在所述第二主表面的区域上，所述模制化合物布置在所述导电层上。

公开(公告)号：US08076784B2

公开(公告)日：2011-12-13

申请号：US12904561

申请日：2010-10-14

申请人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

发明人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

IPC分类号： H01L23/48

CPC分类号： H01L24/96 ,  H01L21/568 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/81

摘要： Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substrate. A second substrate has a first surface and an opposing second surface. The second substrate includes an array of second connection elements on the first surface of the second substrate. The first connection elements is attached to the second connection elements; and is thinning at least one of the first substrate and the second substrate after the attachment of the first connection elements to the second connection elements.

摘要翻译： 公开了堆叠的半导体芯片。 一个实施例提供了包括具有第一表面和相对的第二表面的第一基底的方法。 第一衬底包括在第一衬底的第一表面上的第一连接元件的阵列。 第二基板具有第一表面和相对的第二表面。 第二衬底包括在第二衬底的第一表面上的第二连接元件的阵列。 第一连接元件附接到第二连接元件; 并且在将第一连接元件附接到第二连接元件之后使第一基板和第二基板中的至少一个变薄。

公开(公告)号：US07687895B2

公开(公告)日：2010-03-30

申请号：US11939938

申请日：2007-11-14

申请人： Markus Brunnbauer ,  Jens Pohl ,  Klaus Pressel ,  Thorsten Meyer ,  Recai Sezi ,  Stephan Bradl ,  Ralf Plieninger

发明人： Markus Brunnbauer ,  Jens Pohl ,  Klaus Pressel ,  Thorsten Meyer ,  Recai Sezi ,  Stephan Bradl ,  Ralf Plieninger

IPC分类号： H01L23/02 ,  H01L23/043 ,  H01L23/10 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/28

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/60 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/12105 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05099

摘要： A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also includes an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer. In the molding compound a contact via is arranged.

摘要翻译： 工件具有至少两个半导体芯片，每个半导体芯片具有至少部分暴露的第一主表面和第二主表面。 工件还包括布置在至少两个半导体芯片上的导电层，导电层至少布置在第二主表面的区域上，以及配置在导电层上的模塑料。 在模塑料中配置有接触孔。

公开(公告)号：US20090294961A1

公开(公告)日：2009-12-03

申请号：US12131541

申请日：2008-06-02

申请人： Thorsten Meyer ,  Recai Sezi ,  Markus Brunnbauer

发明人： Thorsten Meyer ,  Recai Sezi ,  Markus Brunnbauer

IPC分类号： H01L23/488 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L24/27 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/116 ,  H01L2224/1183 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/27462 ,  H01L2224/73104 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014

摘要： A semiconductor device includes a semiconductor chip and a metal layer electrically coupled to the semiconductor chip. The semiconductor device includes an array of solder balls coupled to the metal layer and a front side protect material directly contacting the metal layer and laterally surrounding a portion of at least a plurality of solder balls. The front side protect material is configured to become fluid during solder reflow.

摘要翻译： 半导体器件包括电连接到半导体芯片的半导体芯片和金属层。 半导体器件包括耦合到金属层的焊料球阵列和直接接触金属层并横向围绕至少多个焊球的一部分的前侧保护材料。 正面保护材料配置成在回流焊时成为流体。

公开(公告)号：US20090079089A1

公开(公告)日：2009-03-26

申请号：US11859329

申请日：2007-09-21

申请人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

发明人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/96 ,  H01L21/568 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/81

摘要： Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substrate. A second substrate has a first surface and an opposing second surface. The second substrate includes an array of second connection elements on the first surface of the second substrate. The first connection elements is attached to the second connection elements; and is thinning at least one of the first substrate and the second substrate after the attachment of the first connection elements to the second connection elements.

摘要翻译： 公开了堆叠的半导体芯片。 一个实施例提供了包括具有第一表面和相对的第二表面的第一基底的方法。 第一衬底包括在第一衬底的第一表面上的第一连接元件的阵列。 第二基板具有第一表面和相对的第二表面。 第二衬底包括在第二衬底的第一表面上的第二连接元件的阵列。 第一连接元件附接到第二连接元件; 并且在将第一连接元件附接到第二连接元件之后使第一基板和第二基板中的至少一个变薄。

公开(公告)号：US20110024918A1

公开(公告)日：2011-02-03

申请号：US12904561

申请日：2010-10-14

申请人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

发明人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

IPC分类号： H01L23/48

CPC分类号： H01L24/96 ,  H01L21/568 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/81

摘要： Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substrate. A second substrate has a first surface and an opposing second surface. The second substrate includes an array of second connection elements on the first surface of the second substrate. The first connection elements is attached to the second connection elements; and is thinning at least one of the first substrate and the second substrate after the attachment of the first connection elements to the second connection elements.

摘要翻译： 公开了堆叠的半导体芯片。 一个实施例提供了包括具有第一表面和相对的第二表面的第一基底的方法。 第一衬底包括在第一衬底的第一表面上的第一连接元件的阵列。 第二基板具有第一表面和相对的第二表面。 第二衬底包括在第二衬底的第一表面上的第二连接元件的阵列。 第一连接元件附接到第二连接元件; 并且在将第一连接元件附接到第二连接元件之后使第一基板和第二基板中的至少一个变薄。

公开(公告)号：US07867878B2

公开(公告)日：2011-01-11

申请号：US11859329

申请日：2007-09-21

申请人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

发明人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

IPC分类号： H01L21/30

CPC分类号： H01L24/96 ,  H01L21/568 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/81

摘要： Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substrate. A second substrate has a first surface and an opposing second surface. The second substrate includes an array of second connection elements on the first surface of the second substrate. The first connection elements is attached to the second connection elements; and is thinning at least one of the first substrate and the second substrate after the attachment of the first connection elements to the second connection elements.