Invention Application
- Patent Title: Release Strategies for Making Transferable Semiconductor Structures, Devices and Device Components
- Patent Title (中): 制定可转移半导体结构,器件和器件组件的发布策略
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Application No.: US14246962Application Date: 2014-04-07
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Publication No.: US20140361409A1Publication Date: 2014-12-11
- Inventor: John A. ROGERS , Ralph G. NUZZO , Matthew MEITL , Heung Cho KO , Jongseung YOON , Etienne MENARD , Alfred J. BACA
- Applicant: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Applicant Address: US IL URBANA
- Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Current Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Current Assignee Address: US IL URBANA
- Main IPC: H01L31/0735
- IPC: H01L31/0735 ; H01L31/0304 ; H01L31/18

Abstract:
Provided are methods for making a device or device component by providing a multi layer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
Public/Granted literature
- US09349900B2 Release strategies for making transferable semiconductor structures, devices and device components Public/Granted day:2016-05-24
Information query
IPC分类: