公开(公告)号：US20170179100A1

公开(公告)日：2017-06-22

申请号：US15402684

申请日：2017-01-10

申请人： The Board of Trustees of the University of Illinois ,  Semprius, Inc.

发明人： John ROGERS ,  Ralph NUZZO ,  Matthew MEITL ,  Etienne MENARD ,  Alfred BACA ,  Michael MOTALA ,  Jong-Hyun AHN ,  Sang-Il PARK ,  Chang-Jae YU ,  Heung Cho KO ,  Mark STOYKOVICH ,  Jongseung YOON

IPC分类号： H01L25/00 ,  H01L25/075 ,  H01L25/16 ,  H01L25/04

摘要： Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

公开(公告)号：US20160072027A1

公开(公告)日：2016-03-10

申请号：US14800363

申请日：2015-07-15

申请人： The Board of Trustees of the University of Illinois ,  Semprius, Inc.

发明人： John ROGERS ,  Ralph NUZZO ,  Matthew MEITL ,  Etienne MENARD ,  Alfred BACA ,  Michael MOTALA ,  Jong-Hyun AHN ,  Sang-Il PARK ,  Chang-Jae YU ,  Heung Cho KO ,  Mark STOYKOVICH ,  Jongseung YOON

IPC分类号： H01L33/54 ,  H01L25/16 ,  H01L33/56

CPC分类号： H01L25/50 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/00 ,  H01L25/042 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14643 ,  H01L29/78603 ,  H01L29/78681 ,  H01L31/02005 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/0288 ,  H01L31/03046 ,  H01L31/043 ,  H01L31/0525 ,  H01L31/0543 ,  H01L31/0547 ,  H01L31/0693 ,  H01L31/0725 ,  H01L31/167 ,  H01L31/1804 ,  H01L31/1824 ,  H01L31/1868 ,  H01L31/1876 ,  H01L31/1892 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/30 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01S5/021 ,  H01S5/02284 ,  H01S5/183 ,  H01S5/3013 ,  H01S5/34326 ,  H01S5/423 ,  Y02E10/52 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

摘要： Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

摘要翻译： 提供了至少部分地通过基于印刷的组装和器件部件的集成制造的光学器件和系统。 在具体实施方案中，本发明提供包括大面积高性能宏电子器件的可印刷半导体元件的发光系统，光收集系统，光感测系统和光伏系统。 本发明的光学系统包括通过印刷技术组装，组织和/或与其它器件部件集成的半导体元件，所述打印技术表现出与使用常规高温处理方法制造的基于单晶半导体的器件相似的性能特征和功能。 本发明的光学系统具有通过提供一系列有用的装置功能的打印所访问的装置几何形状和构造，例如形状因子，部件密度和部件位置。 本发明的光学系统包括表现出一系列有用的物理和机械性能的装置和装置阵列，包括灵活性，可塑性，适形性和可拉伸性。

公开(公告)号：US20140361409A1

公开(公告)日：2014-12-11

申请号：US14246962

申请日：2014-04-07

申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS

发明人： John A. ROGERS ,  Ralph G. NUZZO ,  Matthew MEITL ,  Heung Cho KO ,  Jongseung YOON ,  Etienne MENARD ,  Alfred J. BACA

IPC分类号： H01L31/0735 ,  H01L31/0304 ,  H01L31/18

CPC分类号： H01L31/0735 ,  B81C1/0046 ,  B81C2201/0191 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y40/00 ,  H01L21/7813 ,  H01L29/155 ,  H01L29/20 ,  H01L31/03046 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/072 ,  H01L31/0725 ,  H01L31/184 ,  H01L31/1844 ,  H01L33/0079 ,  H01L2924/0002 ,  Y02E10/52 ,  Y02E10/544 ,  Y02E10/547 ,  Y02P70/521 ,  Y10T156/1195 ,  H01L2924/00

摘要： Provided are methods for making a device or device component by providing a multi layer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.

摘要翻译： 提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个 的可转移结构。 可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。 该方法和系统提供制造高质量和低成本的光伏器件，可转移的半导体结构（光电）器件和器件部件的手段。

公开(公告)号：US20220199606A1

公开(公告)日：2022-06-23

申请号：US17690952

申请日：2022-03-09

申请人： The Board of Trustees of the University of Illinois ,  X-CELEPRINT LIMITED

发明人： John A. ROGERS ,  Ralph NUZZO ,  Matthew MEITL ,  Etienne MENARD ,  Alfred BACA ,  Michael MOTALA ,  Jong-Hyun AHN ,  Sang-Il PARK ,  Chang-Jae YU ,  Heung Cho KO ,  Mark STOYKOVICH ,  Jongseung YOON

IPC分类号： H01L25/00 ,  H01L27/12 ,  H01L21/00 ,  H01L31/0725 ,  H01L31/18 ,  H01S5/42 ,  H01L25/075 ,  H01L31/054 ,  H01L33/58 ,  H01L33/00 ,  H01S5/02251 ,  H01L31/0525 ,  H01L25/16 ,  H01L33/54 ,  H01L33/56 ,  H01L25/04 ,  H01L31/043 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/0288 ,  H01L31/0693 ,  H01L31/167 ,  H01L33/06 ,  H01L33/30 ,  H01L33/48 ,  H01L33/62 ,  H01S5/02 ,  H01S5/343 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0304 ,  H01L33/52 ,  H01S5/183 ,  H01S5/30

摘要： Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

公开(公告)号：US20170179085A1

公开(公告)日：2017-06-22

申请号：US15402718

申请日：2017-01-10

申请人： The Board of Trustees of the University of Illinois ,  Semprius, Inc.

发明人： John ROGERS ,  Ralph NUZZO ,  Matthew MEITL ,  Etienne MENARD ,  Alfred BACA ,  Michael MOTALA ,  Jong-Hyun AHN ,  Sang-Il PARK ,  Chang-Jae YU ,  Heung Cho KO ,  Mark STOYKOVICH ,  Jongseung YOON

IPC分类号： H01L25/075 ,  H01L33/48 ,  H01L31/054 ,  H01L31/0232 ,  H01L31/167 ,  H01L25/16 ,  H01L27/12 ,  H01L33/62 ,  H01L33/00 ,  H01L33/30 ,  H01L33/06 ,  H01L31/0693 ,  H01L33/54 ,  H01L33/56 ,  H01L31/18 ,  H01L31/0216 ,  H01L31/043 ,  H01L31/0288 ,  H01S5/42 ,  H01S5/02 ,  H01S5/343 ,  H01L33/58

CPC分类号： H01L25/50 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/00 ,  H01L25/042 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14643 ,  H01L29/78603 ,  H01L29/78681 ,  H01L31/02005 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/0288 ,  H01L31/03046 ,  H01L31/043 ,  H01L31/0525 ,  H01L31/0543 ,  H01L31/0547 ,  H01L31/0693 ,  H01L31/0725 ,  H01L31/167 ,  H01L31/1804 ,  H01L31/1824 ,  H01L31/1868 ,  H01L31/1876 ,  H01L31/1892 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/30 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01S5/021 ,  H01S5/02284 ,  H01S5/183 ,  H01S5/3013 ,  H01S5/34326 ,  H01S5/423 ,  Y02E10/52 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

摘要： Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

公开(公告)号：US20160381789A1

公开(公告)日：2016-12-29

申请号：US15084112

申请日：2016-03-29

申请人： The Board of Trustees of the University of Illinois

发明人： John A. ROGERS ,  Matthew MEITL ,  Yugang SUN ,  Heung Cho KO ,  Andrew CARLSON ,  Won Mook CHOI ,  Mark STOYKOVICH ,  Hanqing JIANG ,  Yonggang HUANG ,  Ralph G. NUZZO ,  Zhengtao ZHU ,  Etienne MENARD ,  Dahl-Young KHANG

IPC分类号： H05K1/02 ,  H05K3/22 ,  H01L21/48 ,  H01L23/538

CPC分类号： H01L29/72 ,  H01L21/02422 ,  H01L21/02628 ,  H01L21/4846 ,  H01L21/8258 ,  H01L23/5387 ,  H01L27/12 ,  H01L29/0657 ,  H01L2924/12041 ,  H01L2924/13091 ,  H05K1/0283 ,  H05K3/20 ,  H05K3/22 ,  H05K2201/0133 ,  H05K2201/09045 ,  H05K2203/0271 ,  Y10T29/4913 ,  H01L2924/00

摘要： In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

摘要翻译： 一方面，本发明提供了拉伸，压缩，弯曲或其它变形时能够提供良好性能的可拉伸和可选择的可印刷的部件，例如半导体和电子电路，以及制造或调谐这种可拉伸部件的相关方法。 对于一些应用而言，优选的可拉伸半导体和电子电路除了是可拉伸的之外是柔性的，因此能够沿着一个或多个轴显着地伸长，弯曲，弯曲或其它变形。 此外，本发明的可拉伸半导体和电子电路适用于宽范围的器件配置，以提供完全灵活的电子和光电器件。

公开(公告)号：US20200161291A1

公开(公告)日：2020-05-21

申请号：US16667215

申请日：2019-10-29

申请人： The Board of Trustees of the University of Illinois ,  X-CELEPRINT LIMITED

发明人： John A. ROGERS ,  Ralph NUZZO ,  Matthew MEITL ,  Etienne MENARD ,  Alfred BACA ,  Michael MOTALA ,  Jong-Hyun AHN ,  Sang-Il PARK ,  Chang-Jae YU ,  Heung Cho KO ,  Mark STOYKOVICH ,  Jongseung YOON

IPC分类号： H01L25/00 ,  H01S5/30 ,  H01S5/183 ,  H01S5/022 ,  H01L33/52 ,  H01L31/0304 ,  H01L31/0232 ,  H01L31/02 ,  H01L27/146 ,  H01S5/343 ,  H01S5/02 ,  H01L33/62 ,  H01L33/48 ,  H01L33/30 ,  H01L33/06 ,  H01L33/00 ,  H01L31/18 ,  H01L31/167 ,  H01L31/0693 ,  H01L31/0288 ,  H01L31/0216 ,  H01L27/12 ,  H01L31/043 ,  H01L25/04 ,  H01L33/56 ,  H01L33/54 ,  H01L25/16 ,  H01L31/0525 ,  H01L33/58 ,  H01L31/054 ,  H01L25/075 ,  H01S5/42 ,  H01L31/0725 ,  H01L21/00

摘要： Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

公开(公告)号：US20150237711A1

公开(公告)日：2015-08-20

申请号：US14706733

申请日：2015-05-07

申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS ,  NORTHWESTERN UNIVERSITY

发明人： John A. ROGERS ,  Yonggang HUANG ,  Heung Cho KO ,  Mark STOYKOVICH ,  Won Mook CHOI ,  Jizhou SONG ,  Jong Hyun AHN ,  Dae Hyeong KIM

IPC分类号： H05K1/02 ,  H05K1/11

CPC分类号： H05K1/028 ,  B33Y80/00 ,  H01L21/4867 ,  H01L21/6835 ,  H01L23/4985 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/14601 ,  H01L2221/68359 ,  H01L2224/05624 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H05K1/0283 ,  H05K1/03 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/118 ,  H05K1/16 ,  H05K1/185 ,  H05K3/207 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/0133 ,  H05K2203/0271 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

摘要： Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

摘要翻译： 本文公开了可拉伸，可折叠和任选可印刷的制造方法，用于制造当拉伸，压缩，弯曲或以其它方式变形时能够提供良好性能的诸如半导体，电子电路及其部件的装置和装置。 应变隔离层为功能器件层提供了良好的应变隔离。 多层器件被构造成将中性机械表面重合或接近具有易受应变引起的故障的材料的功能层。 中性机械表面由具有空间不均匀性质的一个或多个层定位，例如通过图案化多层器件的任何层。

公开(公告)号：US20150181700A1

公开(公告)日：2015-06-25

申请号：US14521319

申请日：2014-10-22

申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS ,  NORTHWESTERN UNIVERSITY

发明人： John A ROGERS ,  Yonggang HUANG ,  Heung Cho KO ,  Mark STOYKOVICH ,  Won Mook CHOI ,  Jizhou SONG ,  Jong Hyun AHN ,  Dae Hyeong KIM

IPC分类号： H05K1/02 ,  H05K3/30 ,  H05K3/28 ,  H05K1/18

CPC分类号： H05K1/0283 ,  B33Y80/00 ,  H01L21/4867 ,  H01L21/6835 ,  H01L23/4985 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/14601 ,  H01L2221/68359 ,  H01L2224/05624 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H05K1/03 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/16 ,  H05K1/185 ,  H05K3/207 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/0133 ,  H05K2203/0271 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

摘要： Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

公开(公告)号：US20170179356A1

公开(公告)日：2017-06-22

申请号：US15402723

申请日：2017-01-10

申请人： The Board of Trustees of the University of Illinois ,  Semprius, Inc.

发明人： John ROGERS ,  Ralph NUZZO ,  Matthew MEITL ,  Etienne MENARD ,  Alfred BACA ,  Michael MOTALA ,  Jong-Hyun AHN ,  Sang-Il PARK ,  Chang-Jae YU ,  Heung Cho KO ,  Mark STOYKOVICH ,  Jongseung YOON

IPC分类号： H01L33/62 ,  H01L33/58 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/054 ,  H01L25/16 ,  H01L31/167 ,  H01L27/12 ,  H01L33/00 ,  H01L33/30 ,  H01L31/0304 ,  H01L33/52 ,  H01L27/146 ,  H01L31/18 ,  H01S5/022 ,  H01S5/30 ,  H01S5/183 ,  H01S5/02 ,  H01L25/075

摘要： Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.