Invention Application
- Patent Title: FIN DIODE STRUCTURE
- Patent Title (中): FIN二极管结构
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Application No.: US13941555Application Date: 2013-07-15
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Publication No.: US20150014809A1Publication Date: 2015-01-15
- Inventor: Chang-Tzu Wang , Ping-Chen Chang , Tien-Hao Tang , Kuan-Cheng Su
- Applicant: UNITED MICROELECTRONICS CORP.
- Main IPC: H01L29/861
- IPC: H01L29/861 ; H01L21/76

Abstract:
A fin diode structure and method of manufacturing the same is provided in present invention, which the structure includes a substrate, a doped well formed in the substrate, a plurality of fins of first conductivity type and a plurality of fins of second conductivity type protruding from the doped well, and a doped region of first conductivity type formed globally in the substrate between the fins of first conductivity type, the fins of second conductivity type, the shallow trench isolation and the doped well and connecting with the fins of first doped type and the fins of second doped type.
Public/Granted literature
- US09093565B2 Fin diode structure Public/Granted day:2015-07-28
Information query
IPC分类: