Invention Application
US20150016087A1 Circuit Board, Method For Manufacturing The Circuit Board, And Illumination Device Comprising The Circuit Board 审中-公开
电路板,制造电路板的方法和包括电路板的照明装置

  • Patent Title: Circuit Board, Method For Manufacturing The Circuit Board, And Illumination Device Comprising The Circuit Board
  • Patent Title (中): 电路板,制造电路板的方法和包括电路板的照明装置
  • Application No.: US14377755
    Application Date: 2013-02-07
  • Publication No.: US20150016087A1
    Publication Date: 2015-01-15
  • Inventor: ChengCheng FengXiaomian ChenChuanpeng ZhongHao Li
  • Applicant: OSRAM GMBH
  • Priority: CN201210027869.6 20120208
  • International Application: PCT/EP2013/052454 WO 20130207
  • Main IPC: F21K99/00
  • IPC: F21K99/00
Circuit Board, Method For Manufacturing The Circuit Board, And Illumination Device Comprising The Circuit Board
Abstract:
A circuit board (1) for mounting at least one light source (10), comprising a substrate (2) and a plurality of printed electrical conductors (3) printed on the substrate (2), At least one printed electrical conductor (3) comprises a first region (4) for arranging the light sources (10). The circuit board (1) further comprises reflectors (5) which are disposed between the printed electrical conductors (3) adjacent to each other and cover other regions of the printed electrical conductors (3) than the first region (4), wherein the reflectors (5) are insulating reflectors. The circuit board is easy to manufacture, has relatively high reflective property, and can efficiently reflect the light emitted from the light source. Also disclosed are a method for manufacturing the circuit board, and an illumination device comprising the circuit board.
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