公开(公告)号：US10041658B2

公开(公告)日：2018-08-07

申请号：US14408988

申请日：2013-06-27

Applicant: Osram GmbH

Inventor： Hao Li ,  Xiaomian Chen ,  Peng Chen ,  ChengCheng Feng

IPC: F21V19/00 ,  F21K9/275 ,  F21V15/015 ,  F21Y103/10 ,  F21Y115/10

Abstract: Various embodiments may relate to an illuminating device including a housing, an electronic assembly accommodated in the housing, and at least one adjusting mechanism arranged on at least one side of the electronic assembly, the adjusting mechanism is in operative connection with the electronic assembly and is operated from outside of the housing so that the electronic assembly is tensionedly held in the housing.

公开(公告)号：US20160354880A1

公开(公告)日：2016-12-08

申请号：US15238755

申请日：2016-08-17

Applicant: OSRAM GmbH

Inventor： Xiaomian Chen ,  Xi Huang ,  Hao Li ,  Shang Ping Xiao

IPC: B23P15/26 ,  F21V29/89 ,  F21V29/80 ,  F21V29/77

CPC classification number: B23P15/26 ,  F21V29/77 ,  F21V29/773 ,  F21V29/80 ,  F21V29/86 ,  F21V29/89 ,  F21Y2101/00 ,  F21Y2115/10 ,  F28F1/40 ,  H01L21/4882 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/3731 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A method for making a cooling body for a lighting device may include: a) Providing multiple aluminum nitride ceramic radiators; b) Putting the multiple aluminum nitride ceramic radiators into a mold; c) Closing the mold, and injecting a melting metal into the mold so that the metal encloses a portion of each of the aluminum nitride ceramic radiators, wherein the metal has a melting point lower than that of the aluminum nitride ceramic radiators; and d) Opening the mold, and obtaining the cooling body.

Abstract translation: 制造照明装置的冷却体的方法可以包括：a）提供多个氮化铝陶瓷散热器; b）将多个氮化铝陶瓷散热器放入模具中; c）封闭模具，并将熔融金属注入模具，使得金属包围每个氮化铝陶瓷散热器的一部分，其中金属的熔点低于氮化铝陶瓷散热器的熔点; 和d）打开模具，并获得冷却体。

公开(公告)号：US09516748B2

公开(公告)日：2016-12-06

申请号：US14407074

申请日：2013-06-14

Applicant: OSRAM GmbH

Inventor： Jianghui Yang ,  Chuanpeng Zhong ,  Hao Li ,  Xiaomian Chen

IPC: H05K1/05 ,  H05K1/02 ,  H05K1/18 ,  H05K1/03 ,  H05K3/10 ,  H05K1/14

CPC classification number: H05K1/053 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/142 ,  H05K1/181 ,  H05K3/10 ,  H05K2201/048 ,  H05K2201/06 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.

Abstract translation: 各种实施例涉及包括基底和导热层的电路板。 所述基座的一侧面对所述导热层具有第一区域和第二区域，所述第一区域相对于所述第二区域凹陷，所述第一绝缘层容纳在所述第一区域中，形成第二绝缘层 在第二区域上，第一绝缘层和第二绝缘层具有不同的热导率。 此外，各种实施例还涉及电子模块和包括这种电路板的照明装置。 各种实施例还涉及一种用于制造这种电路板的方法。

公开(公告)号：US20150184838A1

公开(公告)日：2015-07-02

申请号：US14408968

申请日：2013-06-27

Applicant: OSRAM GmbH

Inventor： Hao Li ,  Xiaomian Chen ,  Peng Chen ,  Tingming Liu

IPC: F21V19/00 ,  F21K99/00

CPC classification number: F21V19/009 ,  F21K9/27 ,  F21K9/272 ,  F21K9/90 ,  F21V19/003 ,  F21V19/004 ,  F21Y2103/10 ,  F21Y2115/10 ,  Y02B20/386 ,  Y10T29/49826

Abstract: Various embodiments may relate to an LED retrofit lamp, including a lamp tube, an LED light engine disposed in the lamp tube, and end caps arranged at two open ends of the lamp tube, the LED light engine including a circuit board and at least one light source disposed on the circuit board. The LED retrofit lamp further includes one pair of retaining structures fixed at two opposite ends of the circuit board, respectively, and at least one pair of elastic tension structures connected to the retaining structures. The elastic tension structure goes through the end cap from one side of the end cap and is locked at the other side of the end cap. In addition, various embodiments may also relate to a process for manufacturing the LED retrofit lamp.

Abstract translation: 各种实施例可以涉及一种LED改装灯，其包括灯管，设置在灯管中的LED灯引擎，以及设置在灯管的两个开放端的端盖，所述LED灯引擎包括电路板和至少一个 光源设置在电路板上。 LED改装灯还包括固定在电路板的两个相对端的一对保持结构以及连接到保持结构的至少一对弹性张力结构。 弹性张力结构从端盖的一侧穿过端盖并锁定在端盖的另一侧。 此外，各种实施例还可以涉及用于制造LED改装灯的方法。

公开(公告)号：US20150107882A1

公开(公告)日：2015-04-23

申请号：US14407074

申请日：2013-06-14

Applicant: OSRAM GmbH

Inventor： Jianghui Yang ,  Chuanpeng Zhong ,  Hao Li ,  Xiaomian Chen

IPC: H05K1/05 ,  H05K1/18 ,  H05K3/10 ,  H05K1/02

CPC classification number: H05K1/053 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/142 ,  H05K1/181 ,  H05K3/10 ,  H05K2201/048 ,  H05K2201/06 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.

Abstract translation: 各种实施例涉及包括基底和导热层的电路板。 所述基座的一侧面对所述导热层具有第一区域和第二区域，所述第一区域相对于所述第二区域凹陷，所述第一绝缘层容纳在所述第一区域中，形成第二绝缘层 在第二区域上，第一绝缘层和第二绝缘层具有不同的热导率。 此外，各种实施例还涉及电子模块和包括这种电路板的照明装置。 各种实施例还涉及一种用于制造这种电路板的方法。

公开(公告)号：US10001262B2

公开(公告)日：2018-06-19

申请号：US14408968

申请日：2013-06-27

Applicant: OSRAM GmbH

Inventor： Hao Li ,  Xiaomian Chen ,  Peng Chen ,  Tingming Liu

IPC: F21V21/00 ,  F21V19/00 ,  F21K9/27 ,  F21K9/90 ,  F21Y103/10 ,  F21Y115/10

CPC classification number: F21V19/009 ,  F21K9/27 ,  F21K9/272 ,  F21K9/90 ,  F21V19/003 ,  F21V19/004 ,  F21Y2103/10 ,  F21Y2115/10 ,  Y02B20/386 ,  Y10T29/49826

Abstract: Various embodiments may relate to an LED retrofit lamp, including a lamp tube, an LED light engine disposed in the lamp tube, and end caps arranged at two open ends of the lamp tube, the LED light engine including a circuit board and at least one light source disposed on the circuit board. The LED retrofit lamp further includes one pair of retaining structures fixed at two opposite ends of the circuit board, respectively, and at least one pair of elastic tension structures connected to the retaining structures. The elastic tension structure goes through the end cap from one side of the end cap and is locked at the other side of the end cap. In addition, various embodiments may also relate to a process for manufacturing the LED retrofit lamp.

公开(公告)号：US20140096934A1

公开(公告)日：2014-04-10

申请号：US14119449

申请日：2012-05-03

Applicant: OSRAM GMBH

Inventor： Huijun Xiong ,  You Chen ,  Hao Li ,  Xiaomian Chen

IPC: F21V29/00

CPC classification number: F21V29/713 ,  F21S8/026 ,  F21V21/30 ,  F21V29/77 ,  F21Y2115/10

Abstract: A modular heat sink for LED luminaire may include at least two modular heat sink units, which are joined together in thermal communication with each other for use in the LED luminaire, such that the illuminating angle of the LED luminaire can be adjusted within a range of 0° to 180°.

Abstract translation: 用于LED照明器的模块化散热器可以包括至少两个模块化散热器单元，它们彼此热连接在一起，用于LED照明器，使得LED灯具的照明角度可以在 0°至180°。

公开(公告)号：US20150276323A1

公开(公告)日：2015-10-01

申请号：US14377509

申请日：2013-02-28

Applicant: OSRAM GMBH

Inventor： Hao Li ,  Xiaomian Chen ,  Yangang Cheng ,  Peng Chen

IPC: F28D15/04 ,  B29C65/08 ,  B23P15/26 ,  F28F21/04

CPC classification number: F28D15/04 ,  B23P15/26 ,  B29C65/08 ,  B29C66/1142 ,  B29C66/54 ,  B29C66/547 ,  B29C66/73113 ,  B29C66/959 ,  B29C2037/0039 ,  B29D22/00 ,  B29D23/001 ,  B29L2031/18 ,  F28D15/0233 ,  F28F21/04 ,  F28F21/062 ,  Y10T29/49353

Abstract: A heat pipe may include a tube body, a capillary structure provided on an inner wall of the tube body, and a cooling liquid accommodated in the tube body. The tube body and the capillary structure are made of thermal conductive plastic, respectively.

Abstract translation: 热管可以包括管体，设置在管体的内壁上的毛细管结构和容纳在管体中的冷却液。 管体和毛细结构分别由导热塑料制成。

公开(公告)号：US20150260379A1

公开(公告)日：2015-09-17

申请号：US14408988

申请日：2013-06-27

Applicant: Osram GmbH

Inventor： Hao Li ,  Xiaomian Chen ,  Peng Chen ,  ChengCheng Feng

IPC: F21V19/00 ,  F21K99/00

CPC classification number: F21V19/0055 ,  F21K9/275 ,  F21V15/015 ,  F21Y2103/10 ,  F21Y2115/10

Abstract: Various embodiments may relate to an illuminating device including a housing, an electronic assembly accommodated in the housing, and at least one adjusting mechanism arranged on at least one side of the electronic assembly, the adjusting mechanism is in operative connection with the electronic assembly and is operated from outside of the housing so that the electronic assembly is tensionedly held in the housing.

Abstract translation: 各种实施例可以涉及包括壳体，容纳在壳体中的电子组件和布置在电子组件的至少一侧上的至少一个调节机构的照明装置，调节机构与电子组件可操作地连接，并且是 从壳体的外部操作，使得电子组件被张紧地保持在壳体中。

公开(公告)号：US20150016087A1

公开(公告)日：2015-01-15

申请号：US14377755

申请日：2013-02-07

Applicant: OSRAM GMBH

Inventor： ChengCheng Feng ,  Xiaomian Chen ,  Chuanpeng Zhong ,  Hao Li

IPC: F21K99/00

CPC classification number: F21K9/90 ,  F21K9/60 ,  F21K9/64 ,  F21K9/68 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48464 ,  H01L2933/0033 ,  H05K1/0274 ,  H05K2201/0195 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T29/49156

Abstract: A circuit board (1) for mounting at least one light source (10), comprising a substrate (2) and a plurality of printed electrical conductors (3) printed on the substrate (2), At least one printed electrical conductor (3) comprises a first region (4) for arranging the light sources (10). The circuit board (1) further comprises reflectors (5) which are disposed between the printed electrical conductors (3) adjacent to each other and cover other regions of the printed electrical conductors (3) than the first region (4), wherein the reflectors (5) are insulating reflectors. The circuit board is easy to manufacture, has relatively high reflective property, and can efficiently reflect the light emitted from the light source. Also disclosed are a method for manufacturing the circuit board, and an illumination device comprising the circuit board.

Abstract translation: 1.一种用于安装至少一个光源（10）的电路板（1），包括基板（2）和印刷在所述基板（2）上的多个印刷电导体），至少一个印刷电导体（3） 包括用于布置光源（10）的第一区域（4）。 电路板（1）还包括设置在彼此相邻的印刷电导体（3）之间的反射器（5），并且覆盖印刷电导体（3）的其它区域比第一区域（4），其中反射器 （5）是绝缘反射器。 电路板易于制造，具有较高的反射特性，能够有效地反射从光源发出的光。 还公开了一种用于制造电路板的方法，以及包括该电路板的照明装置。