公开(公告)号：US20150107882A1

公开(公告)日：2015-04-23

申请号：US14407074

申请日：2013-06-14

Applicant: OSRAM GmbH

Inventor： Jianghui Yang ,  Chuanpeng Zhong ,  Hao Li ,  Xiaomian Chen

IPC: H05K1/05 ,  H05K1/18 ,  H05K3/10 ,  H05K1/02

CPC classification number: H05K1/053 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/142 ,  H05K1/181 ,  H05K3/10 ,  H05K2201/048 ,  H05K2201/06 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.

Abstract translation: 各种实施例涉及包括基底和导热层的电路板。 所述基座的一侧面对所述导热层具有第一区域和第二区域，所述第一区域相对于所述第二区域凹陷，所述第一绝缘层容纳在所述第一区域中，形成第二绝缘层 在第二区域上，第一绝缘层和第二绝缘层具有不同的热导率。 此外，各种实施例还涉及电子模块和包括这种电路板的照明装置。 各种实施例还涉及一种用于制造这种电路板的方法。

公开(公告)号：US20150003041A1

公开(公告)日：2015-01-01

申请号：US14362613

申请日：2012-12-05

Applicant: OSRAM GmbH

Inventor： Shengmei Zheng ,  Peng Chen ,  Chuanpeng Zhong ,  Yusheng Ming

IPC: F21K99/00 ,  F21V14/00 ,  F21V13/08

CPC classification number: F21V13/08 ,  F21K9/64 ,  F21V7/22 ,  F21V14/00 ,  F21V14/003 ,  F21Y2115/10

Abstract: A lighting device may include a circuit board with at least one LED chip thereon, sidewalls extending from the circuit board, and a phosphor cover supported on the sidewalls, wherein the circuit board, the phosphor cover, and the sidewalls define a cavity accommodating at least one LED chip, wherein the lighting device further comprises at least one optical member arranged in the cavity, and the optical member has an adjustable reflectivity to adjust the spectral power distribution of emitted light through the phosphor cover and/or the CCT of the emitted light.

Abstract translation: 照明装置可以包括其上具有至少一个LED芯片的电路板，从电路板延伸的侧壁和支撑在侧壁上的荧光体盖，其中电路板，荧光体盖和侧壁限定至少容纳空腔 一个LED芯片，其中所述照明装置还包括布置在所述空腔中的至少一个光学构件，并且所述光学构件具有可调节的反射率，以调节通过所述荧光体盖和/或所发射的光的CCT的发射光的光谱功率分布 。

公开(公告)号：US09516748B2

公开(公告)日：2016-12-06

申请号：US14407074

申请日：2013-06-14

Applicant: OSRAM GmbH

Inventor： Jianghui Yang ,  Chuanpeng Zhong ,  Hao Li ,  Xiaomian Chen

IPC: H05K1/05 ,  H05K1/02 ,  H05K1/18 ,  H05K1/03 ,  H05K3/10 ,  H05K1/14

CPC classification number: H05K1/053 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/142 ,  H05K1/181 ,  H05K3/10 ,  H05K2201/048 ,  H05K2201/06 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.

Abstract translation: 各种实施例涉及包括基底和导热层的电路板。 所述基座的一侧面对所述导热层具有第一区域和第二区域，所述第一区域相对于所述第二区域凹陷，所述第一绝缘层容纳在所述第一区域中，形成第二绝缘层 在第二区域上，第一绝缘层和第二绝缘层具有不同的热导率。 此外，各种实施例还涉及电子模块和包括这种电路板的照明装置。 各种实施例还涉及一种用于制造这种电路板的方法。

公开(公告)号：US20150016087A1

公开(公告)日：2015-01-15

申请号：US14377755

申请日：2013-02-07

Applicant: OSRAM GMBH

Inventor： ChengCheng Feng ,  Xiaomian Chen ,  Chuanpeng Zhong ,  Hao Li

IPC: F21K99/00

CPC classification number: F21K9/90 ,  F21K9/60 ,  F21K9/64 ,  F21K9/68 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48464 ,  H01L2933/0033 ,  H05K1/0274 ,  H05K2201/0195 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T29/49156

Abstract: A circuit board (1) for mounting at least one light source (10), comprising a substrate (2) and a plurality of printed electrical conductors (3) printed on the substrate (2), At least one printed electrical conductor (3) comprises a first region (4) for arranging the light sources (10). The circuit board (1) further comprises reflectors (5) which are disposed between the printed electrical conductors (3) adjacent to each other and cover other regions of the printed electrical conductors (3) than the first region (4), wherein the reflectors (5) are insulating reflectors. The circuit board is easy to manufacture, has relatively high reflective property, and can efficiently reflect the light emitted from the light source. Also disclosed are a method for manufacturing the circuit board, and an illumination device comprising the circuit board.

Abstract translation: 1.一种用于安装至少一个光源（10）的电路板（1），包括基板（2）和印刷在所述基板（2）上的多个印刷电导体），至少一个印刷电导体（3） 包括用于布置光源（10）的第一区域（4）。 电路板（1）还包括设置在彼此相邻的印刷电导体（3）之间的反射器（5），并且覆盖印刷电导体（3）的其它区域比第一区域（4），其中反射器 （5）是绝缘反射器。 电路板易于制造，具有较高的反射特性，能够有效地反射从光源发出的光。 还公开了一种用于制造电路板的方法，以及包括该电路板的照明装置。