Invention Application
- Patent Title: SUBSTRATE TRANSFER METHOD AND DEVICE
- Patent Title (中): 基板传输方法和装置
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Application No.: US14324909Application Date: 2014-07-07
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Publication No.: US20150016936A1Publication Date: 2015-01-15
- Inventor: Takehiro SHINDO
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Priority: JP2013-143899 20130709
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/677 ; H01L21/683
Abstract:
A substrate transfer method includes: a step of placing a first and a second substrate on a first and a second alignment part which are arranged to be vertically spaced from each other by using a first and a second pick. The method further includes a first positioning step of positioning the first pick at a first reception position determined based on an alignment position for the first substrate; a first receiving step of receiving the first substrate from the first alignment part by moving the first pick. The method further includes a second positioning step of positioning the second pick at a second reception position determined based on an alignment position for the second substrate; and a second receiving step of receiving the second substrate from the second alignment part by moving the second pick.
Public/Granted literature
- US09589822B2 Substrate transfer method with a second positioning step Public/Granted day:2017-03-07
Information query
IPC分类:
