公开(公告)号：US20220365187A1

公开(公告)日：2022-11-17

申请号：US17661302

申请日：2022-04-29

Applicant: Tokyo Electron Limited

Inventor： Toshiaki KODAMA ,  Shinji WAKABAYASHI ,  Takehiro SHINDO ,  Tatsuru OKAMURA

IPC: G01S7/497 ,  G01S17/08 ,  H01J37/32 ,  G01S17/88

Abstract: A substrate processing system includes: a substrate processing apparatus including a stage on which a substrate and an annular member are placed; a substrate transport mechanism including a substrate holder; a distance sensor provided in the substrate holder; and a control device, wherein the substrate transport mechanism is configured to place a jig substrate having a reference surface as a reference for a height of the annular member on the stage, wherein the distance sensor is configured to measure a distance from the substrate holder positioned above the stage to the reference surface of the jig substrate and a distance from the substrate holder to the annular member, and wherein the control device is configured to estimate the height of the annular member based on a measurement result of the distance to the reference surface and a measurement result of the distance to the annular member.

公开(公告)号：US20180342409A1

公开(公告)日：2018-11-29

申请号：US15987519

申请日：2018-05-23

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takehiro SHINDO

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67196 ,  H01L21/67161 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67754 ,  H01L21/67781 ,  H01L21/681

Abstract: A vacuum transfer module, to which a load-lock module and a plurality of processing modules for processing substrate in a vacuum atmosphere are connected, has therein a substrate transfer unit for transferring the substrate between the load-lock module and the plurality of processing modules. The vacuum transfer module includes: a housing in which a vacuum atmosphere is generated; and a plurality of adaptor attaching portions to which one of a first adaptor for connecting the load-lock module and a second adaptor for connecting the plurality of processing modules is attached, provided at a sidewall of the housing. The adaptor attaching portions are common for the first adaptor and the second adaptor.

公开(公告)号：US20170011940A1

公开(公告)日：2017-01-12

申请号：US15202658

申请日：2016-07-06

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takehiro SHINDO ,  Tadashi SHIONERI ,  Masahiro DOGOME

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67259 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/68

Abstract: When an edge of a wafer passes above a right sensor and a left sensor disposed in a conveyance route of the wafer to a substrate processing chamber, four edge intersecting points are acquired in a first wafer coordinate system, and a reference edge intersecting point set composed of two adjacent edge intersecting points is created from the four edge intersecting points. Between the two remaining edge intersecting points which do not constitute the reference edge intersecting point set, an edge intersecting point present within an area surrounded by two circles defined based on the two edge intersecting points constituting the reference edge intersecting point set is selected as an effective edge intersecting point, and a central position of a circle passing through the reference edge intersecting points and the effective edge intersecting point is acquired as a central position of the wafer.

Abstract translation: 当晶片的边缘穿过位于晶片的输送路径中的右传感器和左传感器到基板处理室时，在第一晶片坐标系中获取四个边缘交叉点，并且基准边交点点组合 从四个边缘相交点创建两个相邻的边缘相交点。 在不构成参考边缘相交点集的两个剩余边缘相交点之间，选择存在于由构成参考边缘相交点集合的两个边缘相交点限定的两个圆圈围成的区域内的边缘相交点作为有效 并且获取通过参考边缘的交叉点和有效边缘交叉点的圆的中心位置作为晶片的中心位置。

公开(公告)号：US20150016936A1

公开(公告)日：2015-01-15

申请号：US14324909

申请日：2014-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takehiro SHINDO

IPC: H01L21/68 ,  H01L21/677 ,  H01L21/683

CPC classification number: H01L21/68 ,  H01L21/67109 ,  H01L21/67742 ,  H01L21/67754

Abstract: A substrate transfer method includes: a step of placing a first and a second substrate on a first and a second alignment part which are arranged to be vertically spaced from each other by using a first and a second pick. The method further includes a first positioning step of positioning the first pick at a first reception position determined based on an alignment position for the first substrate; a first receiving step of receiving the first substrate from the first alignment part by moving the first pick. The method further includes a second positioning step of positioning the second pick at a second reception position determined based on an alignment position for the second substrate; and a second receiving step of receiving the second substrate from the second alignment part by moving the second pick.

Abstract translation: 基板转印方法包括：通过使用第一和第二拾取将第一和第二基板放置在彼此垂直间隔开的第一和第二对准部分上的步骤。 该方法还包括第一定位步骤，其将第一拾取器定位在基于第一衬底的对准位置确定的第一接收位置; 第一接收步骤，通过移动第一拾取器从第一对准部分接收第一衬底。 该方法还包括第二定位步骤，用于将第二拾取器定位在基于第二衬底的对准位置确定的第二接收位置处; 以及第二接收步骤，通过移动第二拾取器从第二对准部分接收第二衬底。

公开(公告)号：US20250006533A1

公开(公告)日：2025-01-02

申请号：US18697729

申请日：2021-10-13

Applicant: TOKYO ELECTRON LIMITED

Inventor： Wataru MATSUMOTO ,  Takehiro SHINDO ,  Tatsuru OKAMURA ,  Nanako SHINODA ,  Junpei SASAKI

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/68

Abstract: This substrate conveyance method is disclosed for a conveyance device. A conveyance chamber includes a conveyance mechanism having forks, on upper and lower sides, and support a substrate. A buffer chamber is connected to the conveyance chamber, and includes: a mounting unit that mounts a substrate; and, pins that support the substrate. In the method, the conveyance mechanism, with a second substrate supported by the lower fork, is inserted into the buffer chamber in which a first substrate is mounted on the mounting unit, and the first substrate is lifted by the upper fork. In the method, the pins are raised while the first substrate is lifted by the upper fork, and the second substrate supported by the lower fork is lifted by the pins. In the method, the conveyance mechanism is removed from the buffer chamber while the second substrate is lifted by the pins.

公开(公告)号：US20230170239A1

公开(公告)日：2023-06-01

申请号：US17991345

申请日：2022-11-21

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takehiro SHINDO ,  Dongwei LI ,  Lingxin JIANG ,  Shinya OKANO ,  Toshiaki KODAMA ,  Wataru MATSUMOTO

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67748 ,  H01L21/67265 ,  H01L21/67333

Abstract: An apparatus for transferring a substrate to a substrate processing chamber. The apparatus comprises: a substrate transfer chamber having a floor and a side wall; a substrate transfer module comprising a holder and second magnets, and configured to be movable in the substrate transfer chamber by magnetic levitation; and a controller configured to control an operating force for moving the substrate transfer module. The controller comprises: a parameter storage configured to store at least one model parameter; a control schedule creating section configured to acquire identification information and a movement schedule, to obtain the operating force, and to output a control schedule; and a magnetic force adjusting section configured to perform feedforward control.

公开(公告)号：US20220199456A1

公开(公告)日：2022-06-23

申请号：US17552659

申请日：2021-12-16

Applicant: Tokyo Electron Limited

Inventor： Takehiro SHINDO

IPC: H01L21/687 ,  B23Q7/00

Abstract: A method of delivering a substrate includes moving a holder configured to hold the substrate in a substrate transfer device above a region where an elevating member configured to be capable of being raised/lowered is arranged; and delivering the substrate from the holder to the elevating member by simultaneously performing lowering of the holder and raising of the elevating member, or delivering the substrate from the elevating member to the holder by simultaneously performing lowering of the elevating member that supports the substrate and raising of the holder.

公开(公告)号：US20210305081A1

公开(公告)日：2021-09-30

申请号：US17211347

申请日：2021-03-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takehiro SHINDO ,  Shinji WAKABAYASHI

IPC: H01L21/683 ,  H01L21/67

Abstract: A transfer device is disposed in a vacuum transfer chamber. The transfer device includes a structure body having an inner space isolated from the vacuum transfer chamber, an arm that rotates with respect to the structure body, and a vacuum seal structure configured to airtightly seal a sliding portion between the structure body and the arm. Further, the vacuum seal structure includes one or more seal members disposed at the sliding portion; a sealing portion formed by the structure body, the arm, and the seal members, lubricant being sealed in the sealing portion; and a pressure adjusting unit configured to adjust a pressure in the sealing portion.

公开(公告)号：US20240290645A1

公开(公告)日：2024-08-29

申请号：US18655619

申请日：2024-05-06

Applicant: Tokyo Electron Limited

Inventor： Takehiro SHINDO ,  Toshiaki KODAMA

IPC: H01L21/677

CPC classification number: H01L21/67745 ,  H01L21/67742 ,  H01L21/67748

Abstract: An apparatus for transporting a substrate includes a transport chamber including a wall having an opening through which carry-in/out of the substrate to/from the substrate processing chamber is performed and a movement surface having a first magnet, a transport module accommodated in the transport chamber to hold the substrate, including a second magnet to which a magnetic force is applied, and configured to be movable along the movement surface in a floating state from the movement surface, an angle adjusting mechanism provided in the transport chamber to switch an angle of the movement surface between a first angle and a second angle which is closer to a vertical state than the first angle, and a transport passage forming a portion of the transport chamber, and including the movement surface at the second angle to which the movement surface switched to the second angle can be connected.

公开(公告)号：US20240222185A1

公开(公告)日：2024-07-04

申请号：US18605892

申请日：2024-03-15

Applicant: Tokyo Electron Limited

Inventor： Tatsuru OKAMURA ,  Norihiko AMIKURA ,  Masatomo KITA ,  Takehiro SHINDO

IPC: H01L21/687 ,  B25J11/00 ,  B25J19/00 ,  H01L21/67

CPC classification number: H01L21/68707 ,  B25J11/0095 ,  B25J19/0054 ,  H01L21/67248 ,  H01L21/67253

Abstract: A substrate transfer system includes a substrate processing assembly, a substrate transfer assembly, and a controller. The substrate processing assembly includes a substrate processing chamber, a substrate support, and a first temperature sensor that measures a temperature of the substrate support. The substrate transfer assembly includes a substrate transfer chamber, a robotic substrate transferrer, and a temperature control system. The robotic substrate transferrer includes a first end-effector that holds a high-temperature substrate, a second end-effector that holds a low-temperature substrate, and a deposit detector located adjacent to at least one of the end-effectors. The temperature control system includes a cooling gas supply that supplies a cooling gas into the robotic substrate transferrer, a second temperature sensor that measures a temperature of an internal space of the robotic substrate transferrer, and a temperature adjuster that adjusts a temperature of the cooling gas based on an output from the second temperature sensor.