发明申请
- 专利标题: SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE, AND CAMERA MODULE
- 专利标题(中): 固态成像装置,制造固态成像装置的方法和相机模块
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申请号: US14161051申请日: 2014-01-22
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公开(公告)号: US20150042854A1公开(公告)日: 2015-02-12
- 发明人: Motohiro MAEDA , Nagataka Tanaka
- 申请人: Kabushiki Kaisha Toshiba
- 申请人地址: JP Minato-ku
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Minato-ku
- 优先权: JP2013-164362 20130807
- 主分类号: H01L27/148
- IPC分类号: H01L27/148 ; H04N5/369 ; H01L27/146
摘要:
According to one embodiment of the present invention, a solid-state imaging device is provided. The solid-state imaging device includes a first-conductivity-type semiconductor region and a second-conductivity-type semiconductor region. The first-conductivity-type semiconductor region is disposed for each pixel of a captured image. The second-conductivity-type semiconductor region constitutes a photoelectric conversion element by a PN junction with the first-conductivity-type semiconductor region, and has second-conductivity-type impurity concentration that decreases from the center of the photoelectric conversion element toward a transfer gate side for transferring signal charge.
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