Invention Application
- Patent Title: DIE FOR FORMING HONEYCOMB STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Patent Title (中): 用于形成蜂窝结构及其制造方法
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Application No.: US14556516Application Date: 2014-12-01
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Publication No.: US20150086670A1Publication Date: 2015-03-26
- Inventor: Kazumasa KITAMURA , Hirofumi HOSOKAWA , Tomoki NAGAE
- Applicant: NGK Insulators, Ltd.
- Priority: JP2012-126854 20120604
- Main IPC: B28B3/26
- IPC: B28B3/26 ; B23P15/24
Abstract:
Disclosed is a die for forming a honeycomb structure, including: a second plate-shaped portion that has a second bonded surface, where a back hole for introducing a forming raw material is formed; and a first plate-shaped portion that has a first bonded surface, where a slit communicating with the back hole to form a forming raw material is formed, and a cavity communicating with the back hole and the slit is formed in the first bonded surface side, wherein the first plate-shaped portion is arranged on the second plate-shaped portion, an open end of the cavity on the first bonded surface has a diameter different from that of an open end of the back hole on the second bonded surface, and the open end of the cavity on the first bonded surface is arranged inside the open end of the back hole on the second bonded surface.
Information query
