发明申请
- 专利标题： SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
- 专利标题（中）： 基板处理装置和基板处理方法
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申请号： US14383817申请日： 2012-09-07
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公开(公告)号： US20150090694A1公开(公告)日： 2015-04-02
- 发明人: Koji Hashimoto , Masahiro Miyagi , Mitsukazu Takahashi
- 申请人： Koji Hashimoto , Masahiro Miyagi , Mitsukazu Takahashi
- 优先权： JP2012-079913 20120330
- 国际申请： PCT/JP2012/072923 WO 20120907
- 主分类号： H01L21/67
- IPC分类号： H01L21/67
摘要：
A substrate processing apparatus and method includes, a plate that has a size equal to or larger than a principal face of the substrate, and has a horizontal and flat liquid holding face opposing the principal face of the substrate from below. A processing liquid supply unit supplies a processing liquid to the liquid holding face. A control unit controls the processing liquid supply unit and a movement unit to supply the processing liquid to the liquid holding face to form a processing liquid film, a contact step of bringing the principal face of the substrate and the liquid holding face close to each other to bring the principal face of the substrate into contact with the processing liquid film, and a liquid contact maintenance step of maintaining the processing liquid in contact with the principal face of the substrate.
公开/授权文献
- US09601357B2 Substrate processing device and substrate processing method 公开/授权日：2017-03-21