发明申请
- 专利标题： Electronic Component, Arrangement and Method
- 专利标题（中）： 电子元件，布置和方法
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申请号： US14043185申请日： 2013-10-01
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公开(公告)号： US20150091176A1公开(公告)日： 2015-04-02
- 发明人: Ralf Otremba , Josef Höglauer , Jürgen Schredl , Xaver Schlögel , Klaus Schiess
- 申请人： Infineon Technologies Austria AG
- 主分类号： H01L23/13
- IPC分类号： H01L23/13 ; H01L23/48 ; H01L25/065 ; H01L23/00
摘要：
An electronic component includes at least one semiconductor device and a redistribution board comprising at least two nonconductive layers and a conductive redistribution structure. The semiconductor device is embedded in the redistribution board and electrically coupled to the redistribution structure and the redistribution board has a side face with a step. An outer contact pad of the redistribution structure is arranged on the step.
公开/授权文献
- US09196554B2 Electronic component, arrangement and method 公开/授权日：2015-11-24
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